Patent search ap:("IBM") AND inv:"RICH DAVID WILLIAM" Page 1

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发明专利
PROCESS FOR FORMING A METALLURGICAL SYSTEM COMPRISING A BOTTOM LAYER OF NICKEL AND A TOP LAYER OF GOLD 未知

公开(公告)号：DE3665858D1

公开(公告)日：1989-11-02

申请号：DE3665858

申请日：1986-05-06

Applicant: IBM

Inventor： ADWALPALKER AVINASH SRIPAD , HARVILCHUCK JOSEPH MATTHEW , RANALLI JOSEPH ROCCO , RICH DAVID WILLIAM

IPC: H01L21/3205 , B23K20/233 , B23K35/00 , C04B41/52 , C04B41/89 , H01L21/48 , H01L21/60 , H01R43/16 , H05K3/24 , C04B41/90 , C04B41/91

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