公开(公告)号：DE3788155D1

公开(公告)日：1993-12-23

申请号：DE3788155

申请日：1987-04-03

Applicant: IBM

Inventor： ROSENFIELD MICHAEL GERALD ,  SEEGER DAVID EARLE

IPC: H01L21/027 ,  B23K26/14 ,  G03F1/72 ,  G03F7/42 ,  H01L21/30 ,  G03F7/26

Abstract: A system for removing excess material from a semiconductor wafer employs an excimer laser for ablative photocomposition. A wafer is positioned on an X-Y stage that is computer controlled to position the wafer at points where the laser may be focused to remove excess material whether over alignment marks or identified contamination. The laser passes through a vacuum chamber ending in a nozzle structure which by generating an inward laminar flow constrains any particulate contamination resulting from the ablative photodecomposition from spreading. This material is removed by the vacuum system.