公开(公告)号：GB2522269A

公开(公告)日：2015-07-22

申请号：GB201400979

申请日：2014-01-21

Applicant: IBM

Inventor： BAUCHOT FREDERIC ,  CLEMENT JEAN-YVES ,  LEGRAND JEAN-MARC ,  ROUGEAUX FRANCOIS-RENE

IPC: H05K7/20

Abstract: The system includes a room or an enclosure in the form of parallel rows of rack servers separated by aisles to be cooled that is suitable for housing hardware components. The cooling system includes a first air input for controllably allowing input of outside air from outside the enclosure, a second air input for controllably allowing input of recycled air from the enclosure, a cooling mechanism, and an air output for allowing output of air into the enclosure. A control system includes a first temperature monitor for monitoring an outside air temperature, a second temperature monitor for monitoring a blowing air temperature of air at the air output, and a control mechanism for controlling an operation of the first air input, the second air input, the air cooling system in dependence on the monitored temperatures. Hygrometry control can be optimised and an override mechanism is provided in response to exceptional conditions outside of the enclosure. An elongate duct may be provided along and above the hardware racks (Figure 5b).