公开(公告)号：JPH10242082A

公开(公告)日：1998-09-11

申请号：JP1837998

申请日：1998-01-30

Applicant: IBM

Inventor： PANAYOTIS CONSTANTINO ANDRICAK ,  CYRILLE CABRAL JR ,  ROY CAROTHERS ,  ALFRED GRILL ,  CATHRIN SENJER

IPC: H01L21/288 ,  H01L21/02 ,  H01L21/8242 ,  H01L21/8246 ,  H01L21/8247 ,  H01L27/10 ,  H01L27/105 ,  H01L27/108 ,  H01L29/788 ,  H01L29/792

Abstract: PROBLEM TO BE SOLVED: To remove a conductive noble metal plating base from a noble metal patterned electrodeposit region dissimilar to this base, by selecting a multilayered metal material to be alloyed or mixed in the annealing condition. SOLUTION: A structure includes a base 2 having a blanket mat layer of a plating base 1 having electrodeposit features including a noble metal 4 dissimilar to the base plating layer material. The noble metal deposit is electroplated using a mask to be removed later. Selective etching removes the base 1 not alloyed in a region between the features to form a structure. An anneal process is long enough to obtain a good alloy 6 but short enough to prevent the base from becoming excessively dense at the edge of the electrodeposit and the electrodeposit from excessively diffusing laterally in the base region between the features.