公开(公告)号：JP2000036566A

公开(公告)日：2000-02-02

申请号：JP14867499

申请日：1999-05-27

Applicant: IBM

Inventor： RUI RU CHEN SUU ,  MANDELMAN JACK ALLAN

IPC: H01L27/04 ,  H01H85/00 ,  H01L21/60 ,  H01L21/768 ,  H01L21/82 ,  H01L21/822 ,  H01L21/8242 ,  H01L23/525 ,  H01L23/528 ,  H01L27/06

Abstract: PROBLEM TO BE SOLVED: To provide a fuse capable of electrically fusing off at ordinary operational power supply voltage, and also customizing duplication or other circuits at module level as well as fusing method. SOLUTION: Semiconductor fuse is provided between conductors 20 for connecting at least two wirings. This fuse contains spacers 30 arranged on adjacent conductors 20 and a fuse element 31 connected to the wirings 22 arranged between the spacers 30. The space between the conductors 20 contains the first width containing the minimum possible photolithographic width while the fuse element 31 is in the second width narrower than the first width.