公开(公告)号：DE2518193A1

公开(公告)日：1976-01-15

申请号：DE2518193

申请日：1975-04-24

Applicant: IBM

Inventor： DORAN DONALD EDWARD ,  SAMUELSON CARL EDWIN

IPC: B32B15/04 ,  B29C35/02 ,  B29C43/14 ,  B29C43/52 ,  B29C63/00 ,  B29C70/08 ,  B29C70/34 ,  B32B15/08 ,  B32B37/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  H01B5/14 ,  B32B7/02

Abstract: Method of laminating pluralities of sheets as unitary panels with heat and pressure curable adhesive in which unlaminated, uncured sheet pluralities are alternately stacked in a press lay-up with partially cured or semicured unitary sheet pluralities and the entire layup is subjected to heat and pressure for a time sufficient to partially cure the originally uncured sheet pluralities and bring the interspersed, partially cured sheet pluralities to full cure. Thereafter, the newly partially cured and fully cured units are removed and the partially cured units used alternately with new uncured sheet pluralities. This method obviates the need for planishing plates heretofore used to produce smooth surfaces on metal foil covered core units for printed circuit manufacture.