公开(公告)号：FR2292757A1

公开(公告)日：1976-06-25

申请号：FR7531450

申请日：1975-10-06

Applicant: IBM

Inventor： LAZZARINI DONALD J ,  SARNACKI FRANK H

IPC: B23K35/363 ,  B23K35/36 ,  C09K13/06

公开(公告)号：CA1002815A

公开(公告)日：1977-01-04

申请号：CA185430

申请日：1973-11-09

Applicant: IBM

Inventor： SARNACKI FRANK H ,  STEENSTRUP ROBERT V

IPC: H05K3/24 ,  B23K1/00 ,  B23K1/08 ,  B23K3/06 ,  C23C2/32 ,  H05K3/34

Abstract: A method and apparatus utilizing ultrasonic cavitation to level molten solder on wetted surfaces to a controlled and a predetermined thickness. By immersing a surface soldered substrate, printed circuit card, printed circuit board or the like into a heated tank containing a liquid glycerol at approximately 10 DEG C. to 40 DEG C. above the melting point of the solder, it is possible to selectively and ultrasonically cavitate solder from the soldered surfaces to achieve uniform solder thickness.

公开(公告)号：CA994611A

公开(公告)日：1976-08-10

申请号：CA185429

申请日：1973-11-09

Applicant: IBM

Inventor： SARNACKI FRANK H ,  STEENSTRUP ROBERT V

IPC: B23K3/00 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34