公开(公告)号：DE2535375A1

公开(公告)日：1976-08-12

申请号：DE2535375

申请日：1975-08-08

Applicant: IBM

Inventor： LAZZARINI DONALD JOSEPH ,  SARNACKI FRANK HILARY

IPC: B23K35/363 ,  B23K35/36

公开(公告)号：DE2359154A1

公开(公告)日：1974-06-12

申请号：DE2359154

申请日：1973-11-28

Applicant: IBM

Inventor： SARNACKI FRANK HILARY ,  STEENSTRUP ROBERT VERNON

IPC: B23K3/00 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34 ,  H05K13/00

公开(公告)号：DE2357950A1

公开(公告)日：1974-06-12

申请号：DE2357950

申请日：1973-11-21

Applicant: IBM

Inventor： SARNACKI FRANK HILARY ,  STEENSTRUP ROBERT VERNON

IPC: H05K3/24 ,  B23K1/00 ,  B23K1/08 ,  B23K3/06 ,  C23C2/32 ,  H05K3/34 ,  H05K13/00

Abstract: A method and apparatus utilizing ultrasonic cavitation to level molten solder on wetted surfaces to a controlled and a predetermined thickness. By immersing a surface soldered substrate, printed circuit card, printed circuit board or the like into a heated tank containing a liquid glycerol at approximately 10 DEG C. to 40 DEG C. above the melting point of the solder, it is possible to selectively and ultrasonically cavitate solder from the soldered surfaces to achieve uniform solder thickness.

公开(公告)号：DE2344493A1

公开(公告)日：1974-04-11

申请号：DE2344493

申请日：1973-09-04

Applicant: IBM

Inventor： SARNACKI FRANK HILARY ,  STEENSTRUP ROBERT VERNON

IPC: B23K35/363 ,  B23K35/36

Abstract: 1414877 Glycerol soldering flux INTERNATIONAL BUSINESS MACHINES CORP 31 July 1973 [28 Sept 1972] 36335/73 Heading C7M A soldering flux comprises in weight per cent 0.2-0.5 mineral acid e.g. HCl, 80-98 glycerol e.g. 1, 2 3 propanetriol, 0-15 alkyl alcohol and the balance if any, water. The flux also preferably contains 2-4% polycarboxylic acid e.g. tartaric acid, The flux is used for soldering electrical connections and printed circuits. The printed circuit is preferably immersed in the flux which is heated to 10-37.8‹C above the solder melting point.