MAGNETIC TRANSDUCING HEAD ASSEMBLIES

    公开(公告)号:DE3060717D1

    公开(公告)日:1982-09-30

    申请号:DE3060717

    申请日:1980-06-24

    Applicant: IBM

    Abstract: A thin film magnetic head assembly incorporates a nonconductive magnetic substrate which serves as a first pole piece and a thin film magnetic layer for the second pole piece. A magnetoresistive (MR) element is disposed between the pole pieces. During the write mode, the MR element serves as a partial write turn to enhance the write signal current applied to a conductor means. During the read mode, the conductor means serves as a magnetic shield, and the transducing gap is effectively narrowed.

    3.
    发明专利
    未知

    公开(公告)号:DE2639897A1

    公开(公告)日:1977-03-31

    申请号:DE2639897

    申请日:1976-09-04

    Applicant: IBM

    Abstract: An extra MR element is vapor deposited together with a plurality of MR read elements in a head assembly to balance the bias signal and to compensate for thermal drift. The compensation MR element is connected to one input of differential amplifiers whose second input is connected to the read elements. Separate compensation elements can be used to balance an AC bias current distribution by paired 180 DEG out-of-phase operation to prevent overloading of the common ground return lead.

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