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1.Method for fabricating thin film circuit elements and resulting elements 失效
Title translation: 用于制造薄膜电路元件和所得元件的方法公开(公告)号:US3234442A
公开(公告)日:1966-02-08
申请号:US18203362
申请日:1962-03-23
Applicant: IBM
Inventor: MAISSEL LEON I , SILCOX NORMAN W
CPC classification number: H01G4/228 , C23C14/02 , H01G4/10 , Y10T29/435 , Y10T29/49099
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公开(公告)号:US3406036A
公开(公告)日:1968-10-15
申请号:US47055565
申请日:1965-07-08
Applicant: IBM
Inventor: MCGRATH RICHARD S , SILCOX NORMAN W
CPC classification number: C23C18/1608 , C03C17/06 , C03C17/10 , C03C2217/254 , C03C2218/115 , C03C2218/34 , C23C18/1893 , H05K1/0306 , H05K3/182 , Y10T428/24926 , Y10T428/24999
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公开(公告)号:US3379539A
公开(公告)日:1968-04-23
申请号:US41966964
申请日:1964-12-21
Applicant: IBM
Inventor: MCGRATH RICHARD S , HOPEWELL JUNCTION , SILCOX NORMAN W
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公开(公告)号:US3372037A
公开(公告)日:1968-03-05
申请号:US46835565
申请日:1965-06-30
Applicant: IBM
Inventor: MCGRATH RICHARD S , SILCOX NORMAN W
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公开(公告)号:CA757284A
公开(公告)日:1967-04-18
申请号:CA757284D
Applicant: IBM
Inventor: STANDLEY CHARLES L , MAISSEL LEON I , SILCOX NORMAN W
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公开(公告)号:CA781888A
公开(公告)日:1968-04-02
申请号:CA781888D
Applicant: IBM
Inventor: MCGRATH RICHARD S , SILCOX NORMAN W
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公开(公告)号:CA780249A
公开(公告)日:1968-03-12
申请号:CA780249D
Applicant: IBM
Inventor: SILCOX NORMAN W , MCGRATH RICHARD S
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