ID TAG PACKAGE AND RFID SYSTEM
    1.
    发明公开
    ID TAG PACKAGE AND RFID SYSTEM 审中-公开
    ID标签的封装和RFID系统

    公开(公告)号:EP1884888A4

    公开(公告)日:2009-08-19

    申请号:EP06756478

    申请日:2006-05-23

    Applicant: IBM

    Abstract: [PROBLEMS] To provide an ID tag package for RFID, which performs excellent wireless communication regardless of existence of external metal or water and is strong against stresses from the external even under severe use environment, and to provide a RFID system using such package. [MEANS FOR SOLVING PROBLEMS] In the RFID system, an ID tag package (20) has a structure, which covers an ID tag (22) for RFID and has thicknesses (L1, L2) required for reducing electromagnetic wave attenuation due to existence of at least external metal or water. The RFID system includes an elastic layer (24) which can relax stresses from the external.

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