公开(公告)号：JPH1110524A

公开(公告)日：1999-01-19

申请号：JP15966098

申请日：1998-06-08

Applicant: IBM

Inventor： THOMAS R FISHER ,  CAROL E GASTAFSON ,  MICHAEL F ROFARO

IPC: B24B37/30 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a wafer carrier assembly for readjusting a pad for chemo- mechanically grinding a wafer and employed in a device and a method for manufacturing a semiconductor. SOLUTION: A wafer carrier assembly includes a subassembly for adjusting a pad of an original position nondestructively and continuously cleaning the surface of the pad with active liquid as special features. The active liquid may be, in quality, abrasive like slurry or nonabrasive like deionized water. The active liquid helps removing of slurry or residual substance from the surface of the pad. The wafer carrier assembly according to the present invention includes a plurality of legs 102 and a skirt 106 for distributing and supplying adjusting liquid for adjusting the grinding surface of the pad which is rotatably mounted on the leg and chemo-mechanically grind a wafer.