公开(公告)号：JPS62115038A

公开(公告)日：1987-05-26

申请号：JP23471186

申请日：1986-10-03

Applicant: IBM

Inventor： ANIRUKUMAA CHINUTSUPURASADO BA ,  RANDEI UIRIAMU SUNAIDAA ,  UIRIAMU JIYOSEFU SAMA

IPC: C08J5/24 ,  B32B15/08 ,  B32B15/092 ,  C03C25/36 ,  C03C25/40 ,  C08J5/06 ,  C08J5/08 ,  H01B3/40 ,  H05K1/03

公开(公告)号：JPH03222733A

公开(公告)日：1991-10-01

申请号：JP33095790

申请日：1990-11-30

Applicant: IBM

Inventor： RIIROI NIIUERU CHIERISU ,  ROBAATO MEINAADO JIAPU ,  UIRIAMU JIYON RUUDEITSUKU ,  UIRIAMU JIYOSEFU SAMA ,  DEEBITSUDO UEI UAN

IPC: B32B5/00 ,  C08J5/24 ,  C08K7/24 ,  H05K1/03 ,  H05K3/46

Abstract: PURPOSE: To realize a circuit board having excellent points such as thermal expansion characteristics, fire resistance, moisture absorption characteristics, glass transition characteristics and the like by incorporating at least one type of polymer resin, hollow inorganic microspheric filler, binder and reinforcing material in a filling prepreg material having specific permittivity, thereby incorporating a low permittivity. CONSTITUTION: The prepreg material has a permittivity of less than 3.2, and hollow inorganic microspheric filler is coated with a silane binder. A mixture in which a polymer resin, solvent and silane-coated microspheres are distributed at random is formed. And, the prepreg material in which the mixture is impregnated with the reinforcing is formed. The impregnated reinforcing material is partly cured, and partly cured impregnated reinforcing material is cladded with at least one metal layer. The impregnated reinforcing material metal-coated is connected together with a plurality of laminates by heating and pressurizing.

公开(公告)号：JPS62230096A

公开(公告)日：1987-10-08

申请号：JP921787

申请日：1987-01-20

Applicant: IBM

Inventor： JIERARUDO UORUTAA JIYOONZU ,  UIRIAMU ROBAATO PURATSUTO ,  UIRIAMU JIYOSEFU SAMA

IPC: G01N21/88 ,  G01N21/956 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46

公开(公告)号：JPS63250359A

公开(公告)日：1988-10-18

申请号：JP2783688

申请日：1988-02-10

Applicant: IBM

Inventor： ROBAATO JIEEMUZU KOTSUKUSU ,  UIRIAMU JIYOSEFU SAMA ,  DEIBUITSUDO UEI WANGU

IPC: C08G73/06 ,  C07C261/02 ,  C08G73/08 ,  H05K1/03

公开(公告)号：JPS6396934A

公开(公告)日：1988-04-27

申请号：JP12610287

申请日：1987-05-25

Applicant: IBM

Inventor： MAIKERU JIEEMUZU KIYANESUTARO ,  UIRIAMU JIYOSEFU SAMA

IPC: H01L21/60 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40

公开(公告)号：JPS62179931A

公开(公告)日：1987-08-07

申请号：JP29787486

申请日：1986-12-16

Applicant: IBM

Inventor： YUUJIN AANORUDO EGAASU ,  UIRIAMU JIYOSEFU SAMA

IPC: B32B15/08 ,  B32B37/00 ,  B32B38/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38