公开(公告)号：DE2531199A1

公开(公告)日：1976-02-12

申请号：DE2531199

申请日：1975-07-12

Applicant: IBM

Inventor： URFER ERNEST NICHOLAS

IPC: H05K3/46 ,  C04B41/51 ,  C04B41/88 ,  H01B1/00 ,  H01B1/16 ,  H05K1/09 ,  H05K3/12 ,  B22F7/02 ,  C04B37/02 ,  C22C32/00 ,  C23C11/00 ,  H05K3/10

公开(公告)号：FR2280957A1

公开(公告)日：1976-02-27

申请号：FR7517194

申请日：1975-05-27

Applicant: IBM

Inventor： URFER ERNEST NICHOLAS

IPC: H05K3/46 ,  C04B41/51 ,  C04B41/88 ,  H01B1/00 ,  H01B1/16 ,  H05K1/09 ,  H05K3/12 ,  H01B5/14 ,  H05K3/10

Abstract: Electrically conducting matl., for the metallisation of multilayer ceramic modules to produce electrically conducting coatings, on the outer and inner surfaces of the module, is composed of a homogeneous mixt. of Ru and Mo and/or W, pref. contg. 5-40 wt.% Ru and 95-6 wt.% Mo and/or W. The compsn. also contains a dielectric ceramic matl. in an amt. of not over 75% pref. 5-50 vol.% of total vol. The relevant coated layers are the laminated and sintered. The metallisation has improved heat resistance and is resistant to high humidity.

公开(公告)号：DE2254803A1

公开(公告)日：1973-06-07

申请号：DE2254803

申请日：1972-11-09

Applicant: IBM

Inventor： CHANCE DUDLEY AUGUSTUS ,  MILKOVICH STEPHEN ANTHONY ,  POTTER MACY ,  URFER ERNEST NICHOLAS

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/36