公开(公告)号：CA1259947A

公开(公告)日：1989-09-26

申请号：CA454199

申请日：1984-05-11

Applicant: IBM

Inventor： GELCHINSKI MORDECHAI H ,  ROMANKIW LUBOMYR T ,  VIGLIOTTI DONALD R ,  VON GUTFELD ROBERT J

IPC: H01L21/306 ,  C23C18/16 ,  C23F1/00 ,  C23F1/02 ,  C25D5/02 ,  C25D5/08 ,  C25F3/14 ,  H05K3/06 ,  H05K3/24 ,  C25F3/02

Abstract: This metal deposition/material removal technique modifies free-standing or submerged jet plating with an electromagnetic energy beam such as an intense laser beam, directed collinearly along the jet. Experiments were made to deposit gold contact areas on nickel plated beryllium-copper substrates used for microelectronic connectors. The deposits are found to be crack-free and dense, possessing excellent adhesion to the substrate. Deposition rates for 0.05 cm diameter gold spots are on the order of 10 micrometers per second. Also disclosed is a laser jet chemical treatment system wherein relative motion between a cathodically connected workpiece and a fluid jet is provided. The laser beam which is collinear with the jet, cooperates with it to enhance plating or etching rate on the surface of the workpiece.