公开(公告)号：JP2007110115A

公开(公告)日：2007-04-26

申请号：JP2006274688

申请日：2006-10-06

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SINHA ARVIND KUMAR ,  SRI-JAYANTHA SRI M ,  VIJAYESHWAR DAS KHANNA ,  KUCZYNSKI JOSEPH

IPC: H01L23/36

CPC classification number: H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for optimizing heat transfer with electronic components. SOLUTION: A heat transfer assembly comprises a printed circuit board assembly that supports an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. A loading assembly is included for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism that contains a sufficient amount of a thermally conductive medium is provided to transfer heat between the surfaces of one or more of the semiconductor chips and the heat sink assembly. The thermally conductive medium fills every gap or space between the one or more semiconductor chips and the heat sink assembly. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于优化与电子部件的传热的方法和装置。 解决方案：传热组件包括支撑包括一个或多个半导体芯片的电子部件组件的印刷电路板组件。 散热器组件适于与一个或多个半导体芯片热接合。 包括装载组件，用于将一个或多个半导体芯片装载到与散热器组件接合。 提供包含足够量的导热介质的封装机构，以在半导体芯片和散热器组件中的一个或多个的表面之间传递热量。 导热介质填充一个或多个半导体芯片和散热器组件之间的每个间隙或空间。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：SG95584A1

公开(公告)日：2003-04-23

申请号：SG1998001205

申请日：1998-06-05

Applicant: IBM

Inventor： SRI MUTHUTHAMBY SRI-JAYANTHA ,  VIJAYESHWAR DAS KHANNA ,  SURESH KUMAR ,  HEN PHU DANG

IPC: G11B5/54 ,  G11B5/55 ,  G11B5/82 ,  G11B19/04 ,  G11B21/00

Abstract: A data storage device 12 includes a disk 14 having a surface zone 14a for storing data, and an access head 18 mounted on a slider 20 for writing data to and reading data from the data zone. The head 18 flies across the data zone 14a to access selected data tracks during spinning of the disk. And, the slider 20 seeks a predetermined shock buffer zone 30 atop the spinning disk, where critical data is not stored, during an idle mode for confining thereto any shock induced contact between the slider and disk surface.