公开(公告)号：SG89300A1

公开(公告)日：2002-06-18

申请号：SG1999005372

申请日：1999-10-29

Applicant: IBM

Inventor： VOYA RISTA MARKOVICH ,  PETER A MOSCHAK ,  SEUNGBAE PARK ,  SANJEEV BALWANT SATHE

IPC: H01L23/498 ,  H01L21/50 ,  H05K1/02 ,  H05K1/11 ,  H01K3/10

Abstract: A chip carrier constituted of an organic laminate which incorporates structure compensating for thermal deformation of the carrier. Moreover, disclosed is a method of counteracting the thermal deformations encountered by chip carriers, especially during solder reflow, which is predicated on the uniformly, equidistant positioning of metal-plated through-holes (PTH) formed in the chip carrier relative to contact pads. A plurality of plated through-holes (PTH) are positioned equidistantly relative to contact (BGA) pads on a surface of a substrate which is constituted of an organic laminate material, so as to be able to control both in-plane and out-of-plane thermal deformations in the chip carrier material which may be occasioned in a solder reflow furnace or oven.