公开(公告)号：CA978259A

公开(公告)日：1975-11-18

申请号：CA159073

申请日：1972-12-13

Applicant: IBM

Inventor： WAGNER JOHN W ,  YOUNG PAUL M

IPC: G01R31/26 ,  G01R1/073 ,  G01R19/00 ,  H01L21/66

Abstract: An array of test probes individually mounted to a test fixture is provided for contacting a substantially increased number of pads on high density circuit chips. The probes are mounted in side by side relationship in groups with each group of probes making contact with respective pads that are proximately positioned and, preferably, on the same radial line of a chip. Each probe has a contact blade carried by parallel springs of minimum gram load to assure uniform force deflection contact ratios and each blade-spring arrangement acts as the electrical conducting circuit for that probe of the array.