公开(公告)号：JP2002111261A

公开(公告)日：2002-04-12

申请号：JP2000300720

申请日：2000-09-29

Applicant: IBM

Inventor： KURIHARA MIKIO ,  YAMADA YOSHIHISA ,  HANZAWA FUMIHISA

IPC: G02F1/1345 ,  G02F1/13 ,  G02F1/133 ,  G09F9/00 ,  H01L23/36 ,  H01L23/433 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide a radiation structure of an IC which is capable of effectively dispersing heat radiated from the IC. SOLUTION: A first heat conductive rubber 83 is laid on the opposite surface of a printed wiring film 42 to a driver IC 43, a second heat conductive rubber 84 is laid on the opposite surface of the driver IC 43 to the printed wiring film 42, and the first rubber 82 is made harder than the second rubber 84. A heat conductive grease is applied to the contact surface of the first rubber 82 with the wiring film 42 and the contact surface of the second rubber 84 with the driver IC 43.