4.
    发明专利
    未知

    公开(公告)号:FR2370802A1

    公开(公告)日:1978-06-09

    申请号:FR7729875

    申请日:1977-09-28

    Applicant: IBM

    Abstract: A palladium-nickel alloy is plated on electrical components, such as frames, pins, connectors and in general various types of electrical contacts. The palladium-nickel alloys are deposited from a plating bath containing a palladosammine chloride, nickel sulfamate, ammonium sulfamate and ammonium hydroxide, the latter operative to solubilize the metals into the ammonia complex and to maintain the necessary bath pH. The bath can be used for either rack plating at current densities of 10 to 25 amperes per square foot or to barrel plate at a plating current of 1 to 3 amperes per square foot.

    METHOD AND COMPOSITION FOR PLATING PALLADIUM

    公开(公告)号:CA1062650A

    公开(公告)日:1979-09-18

    申请号:CA264593

    申请日:1976-10-25

    Applicant: IBM

    Abstract: METHOD AND COMPOSITION FOR PLATING PALLADIUM This invention relates to the palladium plating of electrical contacts and more particularly to a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added. The method is adapted for rack plating of parts having an irregular shaped configuration as well as those having a uniform configuration.

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