Abstract:
Non-porous ductile palladium is obtained by electrodeposition from a high chloride bath comprising: ABOUT 16 TO ABOUT 32 G/L OF Pd(NH3)2Cl2(palladosammine chloride), about 65 to 250 g/l of NH4Cl and sufficient aqueous NH3 to provide a pH of at least 8.8.
Abstract:
A palladium-nickel alloy is plated on electrical components, such as frames, pins, connectors and in general various types of electrical contacts. The palladium-nickel alloys are deposited from a plating bath containing a palladosammine chloride, nickel sulfamate, ammonium sulfamate and ammonium hydroxide, the latter operative to solubilize the metals into the ammonia complex and to maintain the necessary bath pH. The bath can be used for either rack plating at current densities of 10 to 25 amperes per square foot or to barrel plate at a plating current of 1 to 3 amperes per square foot.
Abstract:
METHOD AND COMPOSITION FOR PLATING PALLADIUM This invention relates to the palladium plating of electrical contacts and more particularly to a method and composition for high speed electroplating of uniform, bright palladium deposits over a wide operating current density range using a palladosammine chloride plating bath to which sodium sulfite has been added. The method is adapted for rack plating of parts having an irregular shaped configuration as well as those having a uniform configuration.