公开(公告)号：US3328765A

公开(公告)日：1967-06-27

申请号：US33471463

申请日：1963-12-31

Applicant: IBM

Inventor： AMDAHL GENE M ,  COUNCILL EDWIN D ,  FLAHERTY ROBERT J ,  ZAGURSKY JOSEPH J

IPC: G06F12/14

CPC classification number: G06F12/1466

公开(公告)号：CA994921A

公开(公告)日：1976-08-10

申请号：CA183364

申请日：1973-10-15

Applicant: IBM

Inventor： BEAULIEU PHILIP E ,  ZAGURSKY JOSEPH J

IPC: H05K7/14 ,  H01L23/04 ,  H01L23/44 ,  H05K7/20

Abstract: This package is suitable for both high density, relatively low input or output circuitry, such as memory circuits, and lower density, high input or output circuitry, such as logic circuits. The package has a plurality of substrates in a stack, with the high input or output circuits mounted on the bottom substrate in the stack and the lower input or output circuits mounted in the remaining substrates of the stack. The bottom substrate forms a portion of one wall of the closed container and has a plurality of interconnection pins in an array coextensive with and carried by its bottom surface. The remaining substrates of the stack have interconnection means brazed around their peripheries which are solder bonded to the next substrate in the stack. The bottom substrate is thus able to have a very large number of input/output pins, and the remaining substrates can be easily separated from the stack for rework purposes. In a preferred form, the package is fluid cooled and contains heat transfer baffles for removing heat from the package.

公开(公告)号：CA754742A

公开(公告)日：1967-03-14

申请号：CA754742D

Applicant: IBM

Inventor： COUNCILL EDWIN D ,  ZAGURSKY JOSEPH J ,  AMDAHL GENE M ,  FLAHERTY ROBERT J