公开(公告)号：CA2210063A1

公开(公告)日：1999-01-08

申请号：CA2210063

申请日：1997-07-08

Applicant: IBM CANADA

Inventor： ROBERT MICHEL ,  ACHARD LOUIS-MARIE ,  BLAIS CLAUDE ,  GARNEAU JEAN-FRANCOIS ,  DANOVITCH DAVID HIRSCH

IPC: B22F5/00 ,  B22F5/12 ,  B22F9/08 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34 ,  H05K3/10 ,  H05K3/40

Abstract: The disclosed invention provides for a method of manufacturing solder columns fo r particular use in attaching substrates to a printed circuit board. The method re sults in columns of homogeneous composition and thus overcomes problems associated with t he phenomena of segregation. The method includes the steps of forming particles of the metal composition to be used for the columns from a molten source of the composition. The solid particles are then formed into segments of homogeneous composition by drawing in gots of the composition into wire and severing the wire into segments.