公开(公告)号：CA2288605C

公开(公告)日：2003-02-11

申请号：CA2288605

申请日：1999-11-08

Applicant: IBM CANADA

Inventor： COICO PATRICK A ,  GUERIN LUC

IPC: H01L23/498 ,  H01L23/50

Abstract: An area array integrated circuit package having contact pads is provided wit h compliant rectangular shaped connection leads each attached to a contact pad. The lead s are arranged and oriented on the surface of the package around the neutral point of the packa ge such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.

公开(公告)号：CA2288605A1

公开(公告)日：2001-05-08

申请号：CA2288605

申请日：1999-11-08

Applicant: IBM CANADA

Inventor： GUERIN LUC ,  COICO PATRICK A

IPC: H01L23/498 ,  H01L23/50

Abstract: An area array integrated circuit package having contact pads is provided wit h compliant rectangular shaped connection leads each attached to a contact pad. The lead s are arranged and oriented on the surface of the package around the neutral point of the packa ge such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.