公开(公告)号：CA2704683A1

公开(公告)日：2010-08-12

申请号：CA2704683

申请日：2010-05-28

Applicant: IBM CANADA

Inventor： BLANDER ALEXANDRE ,  BEAUMIER MARTIN ,  GAGNON PASCALE ,  GAYNES MICHAEL A ,  GIGUERE ERIC ,  SALVAS ERIC ,  TOUSIGNANT LUC

IPC: H01L23/06 ,  H01L23/58

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.