公开(公告)号：CA2676495C

公开(公告)日：2014-04-08

申请号：CA2676495

申请日：2009-08-24

Applicant: IBM CANADA

Inventor： EDWARDS DAVID L ,  LANDREVILLE JEAN-LUC ,  SAVARD CARL ,  LANGE KATHRYN R ,  SIKKA KAMAL K ,  TOY HILTON T

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/34

Abstract: Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.

公开(公告)号：CA2676495A1

公开(公告)日：2011-02-24

申请号：CA2676495

申请日：2009-08-24

Applicant: IBM CANADA

Inventor： EDWARDS DAVID L ,  LANDREVILLE JEAN-LUC ,  SAVARD CARL ,  LANGE KATHRYN R ,  SIKKA KAMAL K ,  TOY HILTON T

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/34

Abstract: Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.