公开(公告)号：DE3114740A1

公开(公告)日：1982-10-28

申请号：DE3114740

申请日：1981-04-11

Applicant: IBM DEUTSCHLAND

Inventor： BRUNSCH ARWED DIPL PHYS DR ,  TRIPPEL GERHARD DIPL PHYS DR ,  RUH WOLF-DIETER DIPL ING

IPC: G11B5/82 ,  G11B5/64 ,  G11B5/738 ,  G11B5/84 ,  G11B5/851 ,  H01F10/16 ,  H01F41/18 ,  H01F41/20 ,  C23C15/00

公开(公告)号：DE3376186D1

公开(公告)日：1988-05-05

申请号：DE3376186

申请日：1983-08-02

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： DRUSCHKE FRANK DR DIPL CHEM ,  KRAUS GEORG ,  KUNZEL ULRICH DR DIPL CHEM ,  RUH WOLF-DIETER DIPL ING ,  SCHAFER ROLF DR

IPC: C23F4/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/3213 ,  H05K3/08 ,  C23F1/00 ,  H01L21/31

Abstract: Cpds. (A) contg. at least one CH3- or -CH2- gp. are used for dry-etching Cu in a glow discharge. The Cu can be etched selectively in the presence of polymers, e.g. after partly masking with a polymer layer of esp. a negative or positive lacquer or a polyimide.

公开(公告)号：DE3477455D1

公开(公告)日：1989-04-27

申请号：DE3477455

申请日：1984-07-16

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： CZIEP WERNER ,  KUNZEL ULRICH DR DIPL CHEM ,  RUH WOLF-DIETER DIPL ING

IPC: H05K3/40 ,  C23F4/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

Abstract: Viaholes are dry-etched into glass fiber reinforced plastic sheets according to a predetermined hole pattern, leaving the glass fiber meshing practically unaffected. The method is used, for instance, to fabricate plastic sheets with unilaterally or bilaterally applied conductor patterns and viaconnectors that are conductively linked to the conductor patterns, and to fabricate multilayer board laminates obtained by several plastic sheets carrying the conductor pattern being alternately packaged, if required, with untreated copper sheets, and by the package thus obtained being subsequently laminated. Such boards and/or plastic sheets bilaterally provided with conductor patterns may be used as connector boards for, say, multilayer ceramic modules carrying semiconductor chips.

公开(公告)号：DE3275147D1

公开(公告)日：1987-02-19

申请号：DE3275147

申请日：1982-03-09

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： BRUNSCH ARWED DR DIPL PHYS ,  TRIPPEL GERHARD DR DIPL PHYS ,  RUH WOLF-DIETER DIPL ING

IPC: G11B5/82 ,  G11B5/64 ,  G11B5/738 ,  G11B5/84 ,  G11B5/851 ,  H01F10/16 ,  H01F41/18 ,  H01F41/20

公开(公告)号：DE2827870A1

公开(公告)日：1980-01-10

申请号：DE2827870

申请日：1978-06-24

Applicant: IBM DEUTSCHLAND

Inventor： SCHNEIDER JOCHEN ,  TRIPPEL GERHARD DIPL PHYS DR ,  BRUNSCH ARWED DIPL PHYS DR ,  RUH WOLF-DIETER DIPL ING

IPC: G11B5/70 ,  G11B5/706 ,  G11B5/02 ,  G11B5/62

Abstract: Magnetic recording carrier as described in the parent patent has a magnetic material (I) with anisotropy perpendicular to the recording surface and a relatively high coercivity of ca. 50-400 Oe, recording/play-back taking place by vertical relative movement between the magnetic head and the carrier. Improvement is that there is a layer of soft magnetic material (II), which has a high magnetisation and a magnetisation direction in the plane of the carrier, between the substrate (III) and (I). Pref. (II) consists of Ni81Fe19 "Fermalloy" (RTM) alloy, amorphous Fe80B2o, amorphous Co74Fe6B2o or an AlFeSi alloy. In particular, Co78.8Fe6.4B14.8 is used as (II) in conjunction with Co6oGd4o as (I). Layers of (I) and (II) are pref. formed on both sides of (III). (II) increases the stray field strength needed for readout and also avoids the possibility of distortion.