公开(公告)号：DE3824654A1

公开(公告)日：1990-02-01

申请号：DE3824654

申请日：1988-07-20

Applicant: IBM DEUTSCHLAND

Inventor： GRUBER HARALD ,  STADLER EWALD E DIPL ING ,  HINRICHSMEYER KURT ,  HORBACH HEINZ-GUENTER

IPC: H01L23/52 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18 ,  H05K1/00 ,  H05K1/18

Abstract: The electronic module (11) has a substrate (12) on which a plurality of chips (13) is disposed and a multiplicity of connection pins (26) which are supported on a pin plate (21 - 24) and are electrically connected to the chips (13) via conductors. At the same time, a plurality of pin plates (21 - 24) provided with connecting pins (26) are provided, each of which is supported by means of at least one flexible connecting element (29), provided with the conductors, on a peripheral region (16 - 19) of a substrate (12) having base area in the shape of any desired polygon in a manner such that it can be folded out of a plane essentially aligned with the plane of the substrate (12) into a position below the substrate (12) or vice versa. This provides an electronic module which is less expensive to manufacture and takes up an appreciably smaller base area for a comparable performance. … …