公开(公告)号：WO2015108991A2

公开(公告)日：2015-07-23

申请号：PCT/US2015/011420

申请日：2015-01-14

Applicant: IMRA AMERICA, INC.

Inventor： OTA, Michiharu ,  ARAI, Alan, Y. ,  LIU, Zhenlin

IPC: B23K26/36

CPC classification number: B23K26/0624 ,  B23K26/0604 ,  B23K26/082 ,  B23K26/36 ,  B23K26/364 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  B23K2203/50 ,  B23K2203/54 ,  C03B33/102

Abstract: In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.

Abstract translation: 在某些实施例中，公开了一种用于材料的基于激光的材料处理的方法和系统。 在至少一个优选的实施方案中，使用单独的脉冲激光源（例如纳秒（NS））和超短脉冲（USP）源（NS-USP）产生时间上重叠的脉冲序列。 脉冲作为一系列空间和时间重叠的脉冲对传送到材料。 材料可以但不一定是透明材料。 在透明材料加工的一些应用中，发现脉冲的组合比单独采用的单个脉冲系列可获得的材料变化和高加工质量要大得多。 公开了其他微加工方法和布置用于在基底上或内部形成精细特征。 这种方法和装置通常可以用NS-USP组合或与其他来源一起使用。

公开(公告)号：WO2016122821A2

公开(公告)日：2016-08-04

申请号：PCT/US2015/068066

申请日：2015-12-30

Applicant: IMRA AMERICA, INC.

Inventor： TURNER, Mark ,  ARAI, Alan, Y. ,  OTA, Michiharu

IPC: B23K26/082 ,  B23K26/382 ,  B23K26/402 ,  B23K26/142 ,  B23K26/146

CPC classification number: B23K26/382 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/142 ,  B23K26/146 ,  B23K26/402 ,  B23K2203/50 ,  B23K2203/52 ,  B23K2203/54

Abstract: The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining. An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n x m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

Abstract translation: 本公开提供了用于液体辅助超短脉冲（USP）激光微加工的基于激光的材料处理系统的实例。 示例性材料处理应用包括使用具有n×m聚焦激光束阵列的并行处理在几乎透明的玻璃工件（衬底）中钻孔通孔或盲孔。 本文公开的方法和系统提供了在细间距布置中形成具有低锥度的高纵横比孔。