Abstract:
PROBLEM TO BE SOLVED: To provide a one-step process for producing and depositing size-selected nanoparticles onto a substrate surface using ultrafast pulsed laser ablation of solid target materials. SOLUTION: This system includes a pulse laser, an optical system, and a vacuum chamber. The pulsed laser has various pulse duration ranging from a few femtoseconds to a few tens of picoseconds. The optical system processes a laser beam such that the beam is focused onto the target surface with an appropriate average energy density and an appropriate energy density distribution. The target and the substrate are installed inside the vacuum chamber, and the background gases and their pressures are appropriately adjusted. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for depositing a transparent thin film and directly depositing a pattern structure.SOLUTION: In the method where a transparent thin film is deposited, and a pattern structure is directly deposited, a pulse laser source is provided, a laser 1 emitted by the pulse laser source is condensed on a target 5 via a transparent substrate 3, the part of the target is melted away or evaporated using the energy of the laser, the substrate is translated to the target, the material of the target melted away or evaporated is deposited on the substrate, and a pattern structure can be formed on the substrate.
Abstract:
PROBLEM TO BE SOLVED: To disclose a p-type semiconductor zinc oxide (ZnO) film, and a method of manufacturing the film.SOLUTION: The film is simultaneously added with phosphorus (P) and lithium (Li). A light path of a pulse laser is arranged so that the pulse laser comes in a substrate from the rear side of the substrate, passes through the substrate and condenses on a target. The substrate is subject to translation movement toward the target, and this arrangement enables deposition of a fine pattern using an ablation plume route. The ablation plume route is present in a one-dimensional transition stage along a normal vector of the target before an angle width of the plume expands in three-dimensional adiabatic expansion. A fine film deposition pattern having a size similar to a laser condensation spot is thus obtained, and a new method of direct film deposition on a patterned material is obtained.
Abstract:
PROBLEM TO BE SOLVED: To provide a p-type semiconductor zinc oxide (ZnO) film and a manufacturing method of this film. SOLUTION: A p-type ZnO material is deposited by using a pulsed laser deposition method (PLD). In this method, a pulsed laser beam is focused on a solid target comprising a mixture of a compound containing both Li and P with ZnO. By the high power density of the focused laser pulse, the material on the target surface is ablated. Then, plasma is formed, and this is deposited on the surface of the substrate. Moreover, there is described a pulsed laser deposition process using a transparent substrate including a pulsed laser source, a substrate that is transparent to the wavelength of the pulsed laser, and a multi-target system. The optical path of the pulsed laser is arranged in such a manner that the pulsed laser is incident from the back of the substrate to pass through the substrate and is focused on the target. By translating the substrate toward the target, the attachment of a micro pattern using the root of an ablation plume is permitted. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
A one-step and room-temperature process for depositing nanoparticles or nanocomposite (nanoparticle-assembled) films of metal oxides such as crystalline titanium dioxide (TiO2) onto a substrate surface using ultrafast pulsed laser ablation of Titania or metal titanium target. The system includes a pulsed laser with a pulse duration ranging from a few femtoseconds to a few tens of picoseconds, an optical setup for processing the laser beam such that the beam is focused onto the target surface with an appropriate average energy density and an appropriate energy density distribution, and a vacuum chamber in which the target and the substrate are installed and background gases and their pressures are appropriately adjusted.