公开(公告)号：WO2016122821A3

公开(公告)日：2016-09-22

申请号：PCT/US2015068066

申请日：2015-12-30

Applicant: IMRA AMERICA INC

Inventor： TURNER MARK ,  ARAI ALAN Y ,  OTA MICHIHARU

IPC: B23K26/082 ,  B23K26/142 ,  B23K26/146 ,  B23K26/382 ,  B23K26/402

CPC classification number: B23K26/382 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/142 ,  B23K26/146 ,  B23K26/402 ,  B23K2203/50 ,  B23K2203/52 ,  B23K2203/54

Abstract: The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining. An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) (1005) using parallel processing with an n x m array of focused laser beams (1040). Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

Abstract translation: 本公开提供了用于液体辅助超短脉冲（USP）激光微加工的基于激光的材料处理系统的实例。 示例性材料处理应用包括使用具有n×m聚焦激光束阵列（1040）的并行处理在几乎透明的玻璃工件（基板）（1005）中钻孔通孔或盲孔。 本文公开的方法和系统提供了形成具有细锥度布置的低锥度的高纵横比孔。