Abstract:
An apparatus and a method for dual mode depth measurement are provided. The apparatus is used for measuring a depth information of a specular surface in a depth from defocus (DFD) mode or measuring a depth information of a textured surface in a depth from focus (DFF) mode. The apparatus includes a light source, a controller, a processor, a lighting optical system, an imaging optical system, a beam splitter and a camera. The controller is for switching between the depth from defocus mode and the depth from focus mode. The lighting optical system is used to focus a light from the light source on an object surface in the depth from defocus mode, and the lighting optical system is used to illuminate the object surface with a uniform irradiance in the depth from focus mode.
Abstract:
A method and a system for depth selective segmentation of an object are provided. The method comprises the following steps. An image is captured in an invisible domain of the optical spectrum by illuminating a scene of interest under an illumination corresponding to said invisible domain of the optical spectrum by an invisible light illumination unit. A binary mask is obtained from the image according to a threshold. Part of the image is eliminated by applying the binary mask to the image, and resulting in another image. The threshold is changed and another binary mask is obtained. The latest obtained binary mask is applied to the latest captured image. The step of changing of the threshold, the step of obtaining a mask and the step of applying the latest obtained binary mask on the latest captured image are performed at least once.
Abstract:
A depth measurement apparatus including an illumination module, a beam splitter, an objective lens, an image capture module, a controller and a processor is provided. The illumination module is configured to generate an illumination beam. The beam splitter and the objective lens are disposed on an optical path of the illumination beam, and the object lens is configured to focus the illumination beam into a hole formed in an object. The image capture module is configured to capture images of the hole at different heights. The controller is coupled to the illumination module and the image capture module. The processor is coupled to the controller and the image capture module, and configured to perform focus distance evaluations on the images captured by the image capture module to obtain a height difference between two surfaces of the object. A depth measurement method is also provided.
Abstract:
A method and a system for measuring a distance from a reference point to an object are provided. The method comprises the following steps. At least one image of an object is captured through a lens comprising a phase mask composed of a parallel plate and a wedge prism. At least two corresponding regions of interest (ROI) are obtained from the images. The regions of interest correspond to identical portions of the object. The relative coordinates between corresponding locations within the corresponding regions of interest is measured. The distance is calculated according to the relative coordinates.
Abstract:
A method of converting 2D images to 3D images and system thereof is provided. According to one embodiment, the method comprises receiving a plurality of 2D images from an imaging device; obtaining motion parameters from a sensor associated with the imaging device; selecting at least two 2D images from the plurality of 2D images based on the motion parameters; determining a depth map based on the selected 2D images and the motion parameters corresponding to the selected 2D images; and generating a 3D image based on the depth map and one of the plurality of 2D images.
Abstract:
A surface topography optical measuring system including image capture modules, a control module and a computation module is provided. Each image capture module includes an electronically controlled focal length tunable lens, an optical assembly and an image sensor, wherein the image capture modules respectively capture images at different heights between a lowest and a highest surfaces of an object. The control module is coupled to the image capture modules to independently control the image capture modules. The computation module is coupled to the control module and the image sensor of each image capture module, wherein the computation module perform calibration of the surface topography optical measuring system and assesses in-focused pixels in the captured images to measure a height difference between a highest and a lowest surfaces of the object or between any surfaces of interest of the object. A surface topography optical measuring method is also provided.
Abstract:
A surface topography optical measuring system including image capture modules, a control module and a computation module is provided. Each image capture module includes an electronically controlled focal length tunable lens, an optical assembly and an image sensor, wherein the image capture modules respectively capture images at different heights between a lowest and a highest surfaces of an object. The control module is coupled to the image capture modules to independently control the image capture modules. The computation module is coupled to the control module and the image sensor of each image capture module, wherein the computation module perform calibration of the surface topography optical measuring system and assesses in-focused pixels in the captured images to measure a height difference between a highest and a lowest surfaces of the object or between any surfaces of interest of the object. A surface topography optical measuring method is also provided.
Abstract:
System and method for profile measurement are provided. The profile measurement system includes a light projector, an imaging device, a control system, and a processing unit. The light projector includes a light source, a mask, and an optical system. An aperture of the mask allows a portion of light to pass through and generates a pattern. The optical system includes a variable focal length lens element configured to project the pattern at different projection distances. The imaging device is configured to capture images of the pattern projected at the different projection distances. The control system is configured to control a projection distance of the light projector and a focus distance of the imaging device. The processing unit is configured to obtain in-focus pixels in the captured images, generate mask images, reconstruct a large depth of field pattern image based on the captured images and reconstruct the object profile.
Abstract:
System and method for profile measurement are provided. The profile measurement system includes a light projector, an imaging device, a control system, and a processing unit. The light projector includes a light source, a mask, and an optical system. An aperture of the mask allows a portion of light to pass through and generates a pattern. The optical system includes a variable focal length lens element configured to project the pattern at different projection distances. The imaging device is configured to capture images of the pattern projected at the different projection distances. The control system is configured to control a projection distance of the light projector and a focus distance of the imaging device. The processing unit is configured to obtain in-focus pixels in the captured images, generate mask images, reconstruct a large depth of field pattern image based on the captured images and reconstruct the object profile.