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公开(公告)号:US20240359433A1
公开(公告)日:2024-10-31
申请号:US18645952
申请日:2024-04-25
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Wen-Chin Lee , Meng-Song Yin , Man-Chun Yu , Wei-Ta Yang
IPC: B32B15/092
CPC classification number: B32B15/092 , B32B2250/03 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2305/08
Abstract: A composition, composite material, and copper clad laminate are provided. The composition includes 100 parts by weight of a compound having two epoxy groups, 20-80 parts by weight of a compound having at least two phenolic hydroxy groups, and 0.01-1.5 parts by weight of an ionic liquid. The ionic liquid is not imidazolium ionic liquid.
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公开(公告)号:US20200174191A1
公开(公告)日:2020-06-04
申请号:US16726904
申请日:2019-12-25
Applicant: Industrial Technology Research Institute
Inventor: Wen-Chin Lee
Abstract: An optical waveguide structure including a bottom layer, a middle waveguide layer, and a top cladding layer is provided. The middle waveguide layer is disposed on the bottom layer. The top cladding layer is disposed on the middle waveguide layer and covers the middle waveguide layer. The refractive index of the middle waveguide layer is greater than that of the bottom layer, and is greater than that of the top cladding layer. The optical waveguide structure has a first end region and a second end region. The middle waveguide layer in the first end region has a first end having a width gradually decreased toward the second end region. The top cladding layer in the second end region has a second end having a width gradually decreased away from the first end region.
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公开(公告)号:US10962713B2
公开(公告)日:2021-03-30
申请号:US16726904
申请日:2019-12-25
Applicant: Industrial Technology Research Institute
Inventor: Wen-Chin Lee
Abstract: An optical waveguide structure including a bottom layer, a middle waveguide layer, and a top cladding layer is provided. The middle waveguide layer is disposed on the bottom layer. The top cladding layer is disposed on the middle waveguide layer and covers the middle waveguide layer. The refractive index of the middle waveguide layer is greater than that of the bottom layer, and is greater than that of the top cladding layer. The optical waveguide structure has a first end region and a second end region. The middle waveguide layer in the first end region has a first end having a width gradually decreased toward the second end region. The top cladding layer in the second end region has a second end having a width gradually decreased away from the first end region.
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公开(公告)号:US20200174195A1
公开(公告)日:2020-06-04
申请号:US16558176
申请日:2019-09-02
Applicant: Industrial Technology Research Institute
Inventor: Wen-Chin Lee , Ming-Chang Lee
Abstract: An optical waveguide structure including a bottom layer, a middle waveguide layer, and a top cladding layer is provided. The middle waveguide layer is disposed on the bottom layer. The top cladding layer is disposed on the middle waveguide layer and covers the middle waveguide layer. The refractive index of the middle waveguide layer is greater than that of the bottom layer, and is greater than that of the top cladding layer. The optical waveguide structure has a first end region and a second end region. The middle waveguide layer in the first end region has a first end having a width gradually decreased toward the second end region. The top cladding layer in the second end region has a second end having a width gradually decreased away from the first end region.
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公开(公告)号:US09052446B2
公开(公告)日:2015-06-09
申请号:US13907984
申请日:2013-06-03
Applicant: Industrial Technology Research Institute
Inventor: Wen-Chin Lee
CPC classification number: G02B6/12 , G02B6/4214 , G02B6/423 , G02B6/4245 , H01L23/13 , H01L23/48 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2924/10158 , H01L2924/15159 , H01L2924/00014 , H01L2924/00
Abstract: The disclosure relates to a chip carrier, suitable for being inserted into a corresponding substrate. The light emitting/receiving chip mounted on the chip carrier is disposed within the corresponding substrate and aligned to the waveguide embedded in the corresponding substrate with an appropriate distance.
Abstract translation: 本公开涉及一种适于插入到相应基板中的芯片载体。 安装在芯片载体上的发光/接收芯片设置在相应的衬底内并且以适当的距离与嵌入相应衬底中的波导对准。
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公开(公告)号:US20140286605A1
公开(公告)日:2014-09-25
申请号:US13907984
申请日:2013-06-03
Applicant: Industrial Technology Research Institute
Inventor: Wen-Chin Lee
CPC classification number: G02B6/12 , G02B6/4214 , G02B6/423 , G02B6/4245 , H01L23/13 , H01L23/48 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2924/10158 , H01L2924/15159 , H01L2924/00014 , H01L2924/00
Abstract: The disclosure relates to a chip carrier, suitable for being inserted into a corresponding substrate. The light emitting/receiving chip mounted on the chip carrier is disposed within the corresponding substrate and aligned to the waveguide embedded in the corresponding substrate with an appropriate distance.
Abstract translation: 本公开涉及一种适于插入到相应基板中的芯片载体。 安装在芯片载体上的发光/接收芯片设置在相应的衬底内并且以适当的距离与嵌入相应衬底中的波导对准。
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