PRODUCTION METHOD FOR AN OPTICAL TRANSMISSION ASSEMBLY
    1.
    发明申请
    PRODUCTION METHOD FOR AN OPTICAL TRANSMISSION ASSEMBLY 审中-公开
    方法用于制造光学变速器总成

    公开(公告)号:WO0153868A3

    公开(公告)日:2002-03-21

    申请号:PCT/DE0100229

    申请日:2001-01-15

    CPC classification number: G02B6/4246 G02B6/4214 G02B6/423

    Abstract: The invention relates to a photo-optical transmission assembly produced in the following manner: a glass wafer (2) is fixed onto a transparent submount (1) and a V-shaped recess (20) is subsequently created between optical prism elements (2a, 2b) using targeted sawcuts. A rod-shaped element (12) with a reflective coating (9) is inserted into the V-shaped recess (20), in such a way that laser illumination (S) from a semiconductor laser (6) is deflected by 90 DEG on the rod-shaped element (12) with reflective coating and penetrates the submount (1).

    Abstract translation: 一种光传输光学组件通过施加到透明Submountwafer(1)形成为玻璃晶片(2)BEFE-Stigt并随后通过定向锯装置切割的棱镜型光学元件之间的V形凹部(20)(2A,2B)被产生。 在V形凹槽(20),其具有Reflexionsbeschich维护的杆构件(12)(9)被引入,发射,使得在90°的反射涂覆杆形元件(12),从半导体激光器(6)的激光辐射(S) 被偏转并通过Submountwafer(1)通过。

    4.
    发明专利
    未知

    公开(公告)号:DE59902175D1

    公开(公告)日:2002-09-05

    申请号:DE59902175

    申请日:1999-09-14

    Abstract: Optoelectronic component production comprises position adjustment of lens coupling optics (9) while operating mounted laser chips (1). An optoelectronic component production process comprises: (a) providing a semiconductor wafer (2) with metallic structures (13) for electrically contacting and mechanically fixing laser chips (1) with beam paths parallel to the wafer; (b) positioning beam deflector lens coupling optics (9) on the wafer; (c) operating the laser chips and adjusting the spacing between the chip and the optics until the deflected laser light (11) provides a predetermined position of the optical image plane (15); and (d) fixing the optics in the adjusted position.

    5.
    发明专利
    未知

    公开(公告)号:DE10002329A1

    公开(公告)日:2001-08-02

    申请号:DE10002329

    申请日:2000-01-20

    Abstract: The invention relates to a photo-optical transmission assembly produced in the following manner: a glass wafer (2) is fixed onto a transparent submount (1) and a V-shaped recess (20) is subsequently created between optical prism elements (2a, 2b) using targeted sawcuts. A rod-shaped element (12) with a reflective coating (9) is inserted into the V-shaped recess (20), in such a way that laser illumination (S) from a semiconductor laser (6) is deflected by 90 DEG on the rod-shaped element (12) with reflective coating and penetrates the submount (1).

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