公开(公告)号：DE19536525B4

公开(公告)日：2005-11-17

申请号：DE19536525

申请日：1995-09-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEE CHARLES-WEE-MING ,  MUELLER KLAUS ,  HENG GUAN-HIN ,  NG CHU-SIU ,  MAYER GUENTER-PAUL ,  CHUA TAT-CHOON ,  LEE PATRICIA-CHOON-MUAH

IPC: H01L23/495 ,  H01L23/50

公开(公告)号：DE59812125D1

公开(公告)日：2004-11-18

申请号：DE59812125

申请日：1998-07-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEE CHARLES-WEE-MING

IPC: H01L23/24 ,  H01L23/31

Abstract: A package for at least one semiconductor body. The package is characterized by being configured in two parts. A first part of the package contains a thin supporting frame which has a thickness of a few micrometers which completely surrounds the surface of the semiconductor body and is raised above a top surface of the semiconductor body at the edge of the semiconductor body. The second part of the package has a cover which is as flat as possible which covers the entire second surface and at least partially covers an upper rim of the supporting frame. A compound forming the supporting frame has a considerably greater viscosity than a compound forming the cover. The supporting frame is used as a flow stop for the covering compound during production of the package. Such so-called PBCSP packages allow packaged components to be produced which have an optimum chip/package ratio. Furthermore, such packaged components have the advantage that they are protected against external influences such as temperature, moisture, humidity and mechanical stress. In comparison with so-called flip chips or bar dies, PBCSP packages according to the invention have the advantage that they are easy to transport and to handle.