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公开(公告)号:DE10008572B4
公开(公告)日:2007-08-09
申请号:DE10008572
申请日:2000-02-24
Applicant: INFINEON TECHNOLOGIES AG
Inventor: STOLZE THILO , LODDENKOETTER MANFRED
IPC: H01L23/32 , H01L23/051 , H01L23/055 , H01L23/12 , H01L23/16 , H01L23/433 , H01L23/495 , H01L23/498 , H01L25/00 , H01L29/74 , H01R13/52 , H01R43/02 , H05K3/34 , H05K3/40 , H05K7/10 , H05K7/12
Abstract: Sleeves (2a, 2b) are connected to a substrate (4). Pins (3) passing into the sleeves also make electrical connection with a circuit board (5). The circuit board is connected to the casing (6). An independent claim is included for the production of the module. Sleeves are set on solder paste applied to the substrate, to be soldered in place. The pins are introduced into the sleeves, making electrical connection between the module and the circuit board. The casing is plastic. During casting of the silicon gel, air is passed through slots in the casing.
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公开(公告)号:DE10019812B4
公开(公告)日:2008-01-17
申请号:DE10019812
申请日:2000-04-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor: LODDENKOETTER MANFRED
IPC: H01L25/065 , H01L23/538 , H01L25/07 , H01L25/18 , H03K17/56
Abstract: To compactly design a circuit configuration of a plurality of electronic components a power semiconductor module, in particular, an externally controllable, matrix converter has conduction devices for input, control, and output signals and/or a connecting device for the electronic components formed among one another as a bus structure on a base substrate.
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公开(公告)号:DE10024377B4
公开(公告)日:2006-08-17
申请号:DE10024377
申请日:2000-05-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor: LODDENKOETTER MANFRED
IPC: H01L23/48 , H01L23/498 , H01L25/07
Abstract: A housing device that is used to accomodate at least one power semiconductor module has increased flexibility. Areas of the housing which are configured to receive contact elements in a variety of positions are configured such that the contact elements can be disposed and oriented in a plurality of ways when disposed in each position.
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