公开(公告)号：DE102004018477B4

公开(公告)日：2008-08-21

申请号：DE102004018477

申请日：2004-04-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHIELE JUERGEN ,  HORNKAMP MICHAEL

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/48 ,  H01L25/07

Abstract: A semiconductor module has a first heat-sink (10) and a second heat-sink (20), at least one controlled semiconductor element (30,40). The first connecting contact (30c, 40c) for controlling the controlled semiconductor element and is electrically insulated by insulating foil (91a, 92a, 92b, 101a, 102a, 102b). A first electrode (11a) arranged between the two heat-sinks, and a second electrode (12a) is arranged between the first electrode (11a) and the second heat-sink (20).