公开(公告)号：US20160208369A1

公开(公告)日：2016-07-21

申请号：US15003259

申请日：2016-01-21

Applicant: INTEGRAN TECHNOLOGIES INC.

Inventor： Gino PALUMBO ,  Iain BROOKS ,  Klaus TOMANTSCHGER ,  Peter LIN ,  Karl AUST ,  Nandakumar NAGARAJAN ,  Francisco GONZALEZ

IPC: C22F1/08 ,  C21D9/00 ,  C21D1/06 ,  C25D3/38 ,  C25D5/50

CPC classification number: C22F1/08 ,  C21D1/06 ,  C21D9/0068 ,  C25D3/12 ,  C25D3/38 ,  C25D5/50

Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low Σ grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 pm). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.

Abstract translation: 多结晶材料通过电沉积前体材料制备，随后进行热处理以诱导材料的晶粒尺寸至少增加三倍，从而产生相对较高的“特殊”低Sgr; 晶界和随机晶体学结构。 前体金属材料具有足够的纯度和细晶粒微结构（例如，平均粒度为4nm至5μm）。 所得到的金属材料适于制造需要高机械或物理各向同性的物品和/或对晶界介导的变形或降解机理的抵抗力。