公开(公告)号：WO2007005860A2

公开(公告)日：2007-01-11

申请号：PCT/US2006026026

申请日：2006-06-30

Applicant: INTEL CORP ,  AOKI RUSSELL ,  CROCKER MICHAEL ,  CARTER DANIEL

Inventor： AOKI RUSSELL ,  CROCKER MICHAEL ,  CARTER DANIEL

IPC: H01L23/473 ,  F01P11/02 ,  F16K3/24 ,  F16K41/04 ,  G01M3/22 ,  H05K7/20

CPC classification number: H05K7/20272 ,  G01M3/228 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing portion may also be provided on the valve shaft to seal the chamber when the valve shaft is inserted a second distance into the opening.

Abstract translation: 根据一些实施例，第一密封部分设置在阀轴上以密封腔室。 例如，当阀轴将第一距离插入腔室的开口时，第一密封部分可以例如密封腔室。 当阀轴在开口中插入第二距离时，也可以在阀轴上设置第二密封部分以密封腔室。

公开(公告)号：WO2006072102A2

公开(公告)日：2006-07-06

申请号：PCT/US2005047684

申请日：2005-12-29

Applicant: INTEL CORP ,  CROCKER MICHAEL ,  CARTER DANIEL ,  KOZYRA KAZIMIERZ

Inventor： CROCKER MICHAEL ,  CARTER DANIEL ,  KOZYRA KAZIMIERZ

IPC: H05K7/20

CPC classification number: H01L23/473 ,  F04D13/0646 ,  F04D29/186 ,  H01L2924/0002 ,  H02K7/14 ,  H02K11/33 ,  H01L2924/00

Abstract: According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing. In some embodiments, the pump may also or alternatively comprise a motor to power the impeller, wherein the motor comprises a rotor and at least two magnets disposed within the housing and at least two electromagnetic coils disposed outside of the housing.

Abstract translation: 根据一些实施例，可以提供用于集成泵和冷板的系统。 在一些实施例中，泵可以包括限定入口以接收流体的外壳和排出流体的出口，设置在壳体内的叶轮，其中叶轮将流体朝向出口移动，电动机为叶轮供电 ，以及至少部分地设置在壳体内的冷板。 在一些实施例中，泵还可以或者可选地包括用于为叶轮供电的马达，其中马达包括转子和设置在壳体内的至少两个磁体和布置在壳体外部的至少两个电磁线圈。

公开(公告)号：WO2007002957A3

公开(公告)日：2007-07-19

申请号：PCT/US2006026369

申请日：2006-06-29

Applicant: INTEL CORP ,  CROCKER MICHAEL ,  CARTER DANIEL

Inventor： CROCKER MICHAEL ,  CARTER DANIEL

IPC: H01L23/46 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to some embodiments, systems for an integrated cold plate (110, 210) and heat exchanger may be provided. In some embodiments, a device may comprise a cold plate to transfer heat to a fluid and a heat spreader (108, 308) integral with the cold plate, the heat spreader to accept heat from an electronic device. In some embodiments, the heat spreader and the cold plate are monolithic.

Abstract translation: 根据一些实施例，可以提供用于集成冷板（110,210）和热交换器的系统。 在一些实施例中，装置可以包括将热量传递到流体的冷板和与冷板一体的散热器（108,308），散热器接收来自电子设备的热量。 在一些实施例中，散热器和冷板是整体的。

公开(公告)号：WO2007002939A2

公开(公告)日：2007-01-04

申请号：PCT/US2006025946

申请日：2006-06-29

Applicant: INTEL CORP ,  CROCKER MICHAEL ,  CARTER DANIEL ,  KOZYRA KAZIMIERZ

Inventor： CROCKER MICHAEL ,  CARTER DANIEL ,  KOZYRA KAZIMIERZ

IPC: H01L23/473 ,  F04D29/58 ,  H01L23/367

CPC classification number: F04D29/588 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.

Abstract translation: 根据一些实施例，可以提供用于低成本同轴液体冷却的系统。 在一些实施例中，系统可以包括轴。 该系统还可以包括耦合到泵的热交换器，其中热交换器和泵相对于轴线定向。

公开(公告)号：WO2006072109A3

公开(公告)日：2006-08-17

申请号：PCT/US2005047691

申请日：2005-12-29

Applicant: INTEL CORP ,  CROCKER MICHAEL ,  CARTER DANIEL

Inventor： CROCKER MICHAEL ,  CARTER DANIEL

IPC: F28D1/06 ,  H01L23/34

CPC classification number: F28F3/02 ,  F28D2021/0031 ,  F28F3/12 ,  F28F13/06 ,  F28F2250/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of fins extending outwardly from the core between the first and second ends, an inlet to accept a fluid, an outlet to evacuate the fluid, and a shaped element disposed within the cavity of the core, wherein the shaped element is to direct the fluid within the cavity. According to some embodiments, the system may further comprise a pump that may comprise a housing defining an inlet to accept the fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing.

Abstract translation: 根据一些实施例，可以提供用于低成本液体冷却的系统。 在一些实施例中，系统可以包括具有第一端部和第二端部的芯部，其中芯部限定在第一端部和第二端部之间延伸的空腔，多个在第一端部和第二端部之间从芯部向外延伸的翅片， 接受流体的入口，排出流体的出口以及设置在芯的空腔内的成形元件，其中成形元件将引导空腔内的流体。 根据一些实施例，该系统还可以包括泵，该泵可以包括限定入口以接收流体和排出流体的出口的壳体，设置在壳体内的叶轮，其中叶轮将流体朝向出口 ，为叶轮提供动力的马达，以及至少部分设置在壳体内的冷却板。

公开(公告)号：DE112005003325T5

公开(公告)日：2008-02-14

申请号：DE112005003325

申请日：2005-12-29

Applicant: INTEL CORP

Inventor： CROCKER MICHAEL ,  CARTER DANIEL

IPC: F28D1/06 ,  H01L23/24

Abstract: According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of fins extending outwardly from the core between the first and second ends, an inlet to accept a fluid, an outlet to evacuate the fluid, and a shaped element disposed within the cavity of the core, wherein the shaped element is to direct the fluid within the cavity. According to some embodiments, the system may further comprise a pump that may comprise a housing defining an inlet to accept the fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing.

公开(公告)号：DE112017003702T5

公开(公告)日：2019-05-29

申请号：DE112017003702

申请日：2017-06-22

Applicant: INTEL CORP

Inventor： MILLER STEVEN C ,  CROCKER MICHAEL ,  GORIUS AARON ,  DORMITZER PAUL

IPC: G06F13/40

Abstract: Beispiele können einen Schlitten für ein Rack eines Datenzentrums, einschließlich physikalischer Speichervorrichtungen, enthalten. Der Schlitten umfasst eine Anordnung von Speichervorrichtungen und eine Anordnung von Speichern. Die Speichervorrichtungen und die Speicher sind direkt mit Speicherressourcen-Verarbeitungsschaltungen gekoppelt, die selbst direkt an die optische Dual-Mode-Netzwerkschnittstellenschaltung gekoppelt sind. Die optische Dual-Mode-Netzwerkschnittstellenschaltung kann eine Bandbreite aufweisen, die gleich der oder größer als die der Speichervorrichtungen ist.

公开(公告)号：DE112017003691T5

公开(公告)日：2019-04-04

申请号：DE112017003691

申请日：2017-06-22

Applicant: INTEL CORP

Inventor： KUMAR MOHAN J ,  NACHIMUTHU MURUGASAMY ,  GORIUS AARON ,  CROCKER MICHAEL

IPC: H04L12/861

Abstract: Beispiele können Techniken zum Zuteilen von physischen Beschleunigerressourcen aus Pools von Beschleunigerressourcen beinhalten. Insbesondere können virtuelle Datenverarbeitungsvorrichtungen aus physischen Ressourcen und physischen Beschleunigerressourcen, die den virtuellen Datenverarbeitungsvorrichtungen dynamisch zugeteilt sind, zusammengestellt werden. Die vorliegende Offenbarung stellt es bereit, dass physische Beschleunigerressourcen einer virtuellen Datenverarbeitungsvorrichtung dynamisch zugeteilt oder zu dieser zusammengestellt werden können, obwohl sie an andere Komponenten in der virtuellen Vorrichtung nicht physisch gekoppelt sind.

公开(公告)号：MY117199A

公开(公告)日：2004-05-31

申请号：MYPI9904375

申请日：1999-10-09

Applicant: INTEL CORP

Inventor： WONG THOMAS ,  CROCKER MICHAEL ,  DAVISON PETER ,  MACGREGOR MIKE ,  BENEFIELD JOE

IPC: H05K7/20 ,  H05K5/00 ,  H05K7/14

Abstract: A COVER (12) FOR A SUBSTRATE (18) OF AN ELECTRONIC ASSEMBLY (10). THE COVER (12) MAY INCLUDE A -SNAP-IN PIN (30) THAT CAN BE INSERTED THROUGH AN OPENING (24) OF THE SUBSTRATE. THE COVER (12) MAY ALSO HAVE A BARBED PIN (32) THAT EXERTS A FORCE ONTO THE SUBSTRATE (18). THE FORCE SECURES THE PIN TO THE SUBSTRATE. THE SNAP-IN PIN (30) AND BARBED PIN (32) MAY EXTEND FROM A PANEL PORTION (28) OF THE COVER (12) WHICH COVERS ONE SIDE OF THE SUBSTRATE (18). THE ENTIRE COVER (12) MAY BE CONSTRUCTED AS A RELATIVELY INEXPENSIVE PLASTIC INJECTION MOLDED PART. (FIGURE 2)

公开(公告)号：AU5676499A

公开(公告)日：2000-03-14

申请号：AU5676499

申请日：1999-08-17

Applicant: INTEL CORP

Inventor： LLAPITAN DAVID J ,  CROCKER MICHAEL ,  DAVISON PETER

IPC: H01L23/40 ,  H05K7/14 ,  H05K7/20 ,  H01R13/62 ,  H01R13/73

Abstract: A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.