公开(公告)号：WO03058714A3

公开(公告)日：2003-10-16

申请号：PCT/US0236039

申请日：2002-11-07

Applicant: INTEL CORP

Inventor： FITZGERALD THOMAS ,  DEPPISCH CARL ,  HUA FAY

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/34

CPC classification number: H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract translation: 一种用于设计和制造集成散热器的装置和方法，使得集成的散热器将具有平坦表面，在将其组装成封装件并暴露于模具的热量之后，将散热器安装在该平面上。 这种用于设计和制造集成散热器的装置和方法将产生散热器，该散热器将补偿由（1）装配期间的物理操纵（2）运行期间的热梯度和（3）不同的膨胀和收缩速率导致的变形 的包装材料在高温下与多个包装组装步骤相结合，使得一体式散热器的一个表面将具有平坦的形状。

公开(公告)号：WO03096416A2

公开(公告)日：2003-11-20

申请号：PCT/US0310485

申请日：2003-04-02

Applicant: INTEL CORP

Inventor： HUA FAY ,  DEPPISCH CARL ,  WHITTENBURG KRISTA

IPC: H01L21/56 ,  H01L23/36 ,  H01L23/42 ,  H01L23/498 ,  H01L23/373

CPC classification number: H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

Abstract: Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

Abstract translation: 反应性焊料。 反应性焊料材料可以焊接到半导体表面，例如晶片或晶片的背面。 反应性焊料材料包括与活性元素材料合金化的基底焊料。 反应性焊料材料也可以应用于热管理装置的一部分。 反应性焊料材料可用作半导体表面和热管理装置之间的导热界面。

公开(公告)号：DE602005021974D1

公开(公告)日：2010-08-05

申请号：DE602005021974

申请日：2005-09-30

Applicant: INTEL CORP

Inventor： GARNER MICHAEL ,  HUA FAY

IPC: B22F1/00

公开(公告)号：MY138750A

公开(公告)日：2009-07-31

申请号：MYPI20023288

申请日：2002-09-03

Applicant: INTEL CORP

Inventor： FITZGERALD THOMAS J ,  DEPPISCH CARL L ,  HUA FAY

IPC: G01R31/26 ,  H01L23/367 ,  H01L23/373

Abstract: A DEVICE AND METHOD FOR DESIGNING AND MANUFACTURING AN INTEGRATED HEAT SPREADER (10) SO THAT THE INTEGRATED HEAT SPREADER(10) WILL HAVE A FLAT SURFACE ON WHICH TO MOUNT A HEAT SINK (70) AFTER BEING ASSEMBLED INTO A PACKAGE AND EXPOSED TO THE HEAT OF A DIE (50). THIS DEVICE AND METHOD FOR DESIGNING AND MANUFACTURING AN INTEGRATED HEAT SPREADER (10) WOULD GENERATE A HEAT SPREADER THAT WOULD BE BUILT COMPENSATE FOR DEFORMATIONS RESULTING FROM (1) PHYSICAL MANIPULATION DURING ASSEMBLY (2) THERMAL GRADIENTS DURING OPERATION AND (3) DIFFERING RATES OF EXPANSION AND CONTRACTION OF THE PACKAGE MATERIALS COUPLED WITH MULTIPLE PACKAGE ASSEMBLY STEPS AT ELEVATED TEMPERATURES SO THAT ONE SURFACE OF THE INTEGRATED HEAT SPREADER (10) WOULD HAVE A FLAT SHAPE.

公开(公告)号：MY166632A

公开(公告)日：2018-07-17

申请号：MYPI20031592

申请日：2003-04-26

Applicant: INTEL CORP

Inventor： HUA FAY ,  DEPPISCH CARL L ,  WHITTENBURG KRISTA J

IPC: H01L23/373 ,  B23K35/26 ,  H01L21/56 ,  H01L23/36 ,  H01L23/42 ,  H01L23/498

Abstract: REACTIVE SOLDER MATERIAL (100). THE REACTIVE SOLDER MATERIAL (100) MAY BE SOLDERED TO SEMICONDUCTOR SURFACES SUCH AS THE BACKSIDE OF A DIE (160) OR WAFER. THE REACTIVE SOLDER MATERIAL (100) INCLUDES A BASE SOLDER MATERIAL (100) ALLOYED WITH AN ACTIVE ELEMENT MATERIAL (610). THE REACTIVE SOLDER MATERIAL (100) MAY ALSO BE APPLIED TO A PORTION OF A THERMAL MANAGEMENT DEVICE. THE REACTIVE SOLDER MATERIAL (100) MAY BE USEFUL AS A THERMALLY CONDUCTIVE INTERFACE BETWEEN A SEMICONDUCTOR SURFACE AND A THERMAL MANAGEMENT DEVICE.

公开(公告)号：HK1111123A1

公开(公告)日：2008-08-01

申请号：HK08105845

申请日：2008-05-26

Applicant: INTEL CORP

Inventor： HUA FAY ,  GARNER MICHAEL

IPC: B22F20060101

Abstract: A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell about the first metal. A microelectronic package is also disclosed that uses the nano-sized metal particle composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the nano-sized metal particle composition.

公开(公告)号：WO2007005592A3

公开(公告)日：2007-08-30

申请号：PCT/US2006025548

申请日：2006-06-30

Applicant: INTEL CORP ,  HUA FAY

Inventor： HUA FAY

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49816 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1141 ,  H01L2224/11436 ,  H01L2224/1147 ,  H01L2224/1152 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13416 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/27436 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

Abstract: A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also disclosed that uses the reflowed nanosolder composition. A method of assembling a microelectronic package includes preparing a wire interconnect template. A computing system includes a nanosolder composition coupled to a wire interconnect.

Abstract translation: 纳米尺寸金属颗粒复合材料包括粒径为约50纳米或更小的第一金属。 电线互连与回流纳米溶剂接触并具有与回流纳米溶剂相同的金属或合金组成。 还公开了使用回流纳米涂料组合物的微电子封装。 一种组装微电子封装的方法包括制备导线互连模板。 计算系统包括耦合到电线互连的纳米涂料组合物。

公开(公告)号：WO2007002902A3

公开(公告)日：2007-05-10

申请号：PCT/US2006025625

申请日：2006-06-28

Applicant: INTEL CORP ,  HUA FAY ,  MAVEETY JAMES G

Inventor： HUA FAY ,  MAVEETY JAMES G

IPC: C09K5/14 ,  H01L23/00

CPC classification number: H01L23/373 ,  C09K5/14 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/00

Abstract: A thermal interface material is provided using composite particles. Advantages include increased thermal conductivity and improved mechanical properties such as lower viscosity. In selected embodiments free particles such as metallic particles or carbon nanotubes, etc. are included in a thermal interface material along with composite particles. An advantage of including free particles along with composite particles includes improved packing density within selected embodiments of thermal interface materials.

Abstract translation: 使用复合颗粒提供热界面材料。 优点包括增加的导热性和改善的机械性能，例如较低的粘度。 在选择的实施方案中，诸如金属颗粒或碳纳米管等的自由颗粒与复合颗粒一起被包括在热界面材料中。 包括游离颗粒与复合颗粒一起的优点包括在热界面材料的选定实施方案中改进的填充密度。

公开(公告)号：WO2006132663A2

公开(公告)日：2006-12-14

申请号：PCT/US2005035409

申请日：2005-09-30

Applicant: INTEL CORP ,  HUA FAY ,  GARNER MICHAEL

Inventor： HUA FAY ,  GARNER MICHAEL

IPC: B22F1/00

CPC classification number: C22C5/02 ,  B22F1/025 ,  B23K35/0244 ,  H01B1/02 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K3/3484 ,  H05K2201/0257 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell about the first metal. A microelectronic package is also disclosed that uses the nano-sized metal particle composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the nano-sized metal particle composition.

Abstract translation: 纳米尺寸金属颗粒组合物包括具有约20纳米或更小的粒度的第一金属。 纳米尺寸金属颗粒可以包括围绕第一金属形成壳的第二金属。 还公开了使用纳米尺寸金属颗粒组合物的微电子封装。 还公开了组装微电子封装的方法。 还公开了包括纳米尺寸金属颗粒组合物的计算系统。

公开(公告)号：WO2004095574B1

公开(公告)日：2004-12-29

申请号：PCT/US2004005054

申请日：2004-02-19

Applicant: INTEL CORP

Inventor： JADHAV SUSHEEL ,  DEPPISCH CARL ,  HUA FAY

IPC: H01L23/373

CPC classification number: H01L23/3736 ,  H01L2924/0002 ,  Y10T29/49117 ,  H01L2924/00

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the surface. A heat dissipating element may be coupled to the primary material.

Abstract translation: 装置和系统及其制造方法可以包括具有表面的模具和包含锡，纯锡或耦合到表面的基本上纯的锡的主要材料。 散热元件可以耦合到初级材料。