公开(公告)号：DE112017003344T5

公开(公告)日：2019-03-21

申请号：DE112017003344

申请日：2017-05-31

Applicant: INTEL CORP

Inventor： AHRENS MICHAEL ,  DASKALAKIS GEORGE H ,  LOFLAND STEVEN J ,  PIDWERBECKI DAVID ,  QIU BO ,  RAUPP JAMES C ,  YEE STACY L

IPC: G06F1/16

Abstract: Systeme, Verfahren und Vorrichtungen können eine flexible Display-Anordnung mit einem flexiblen Display und einer Rückwand, die mit dem flexiblen Display verbunden ist, bereitstellen, wobei wenigstens ein Abschnitt der Rückwand ein superelastisches Blech umfasst. In einem Beispiel weist die Rückwand einen ersten starren Metallblechabschnitt und einen zweiten starren Metallblechabschnitt auf, wobei das superelastische Blech zwischen dem ersten und dem zweiten starren Metallblechabschnitt eingefügt ist.

公开(公告)号：EP3160729A4

公开(公告)日：2017-11-08

申请号：EP15811951

申请日：2015-04-29

Applicant: INTEL CORP

Inventor： SPRENGER MARK ,  GWIN PAUL ,  PIDWERBECKI DAVID ,  MAGI ALEKSANDER

IPC: B60R11/02 ,  B32B3/06 ,  B32B3/30 ,  B32B7/12

CPC classification number: H05K5/02 ,  B32B3/30 ,  B32B7/10 ,  B32B7/12 ,  B32B2307/51 ,  B32B2307/744 ,  B32B2457/00

公开(公告)号：EP3161583A4

公开(公告)日：2018-03-14

申请号：EP15812146

申请日：2015-06-02

Applicant: INTEL CORP

Inventor： SPRENGER MARK E ,  AOKI RUSSELL S ,  MCEUEN SHAWN S ,  MACDONALD MARK ,  PIDWERBECKI DAVID

IPC: G06F1/16 ,  H04M1/02

CPC classification number: G06F1/1681 ,  G06F1/1616 ,  H04M1/022

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.

公开(公告)号：EP3055749A4

公开(公告)日：2017-11-01

申请号：EP13895118

申请日：2013-12-26

Applicant: INTEL CORP

Inventor： PIDWERBECKI DAVID ,  GALLINA MARK ,  HEMMEYER MARK ,  LOFLAND STEVEN ,  ILAVARASAN PONNIAH ,  STEWART MICHAEL ,  BYRD KEVIN

IPC: G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H04M1/02 ,  H04M1/18 ,  H05K3/28

CPC classification number: H04B1/3888 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/18 ,  G06F1/182 ,  G06F1/203 ,  H04M1/0202 ,  H04M1/026 ,  H04M1/0262 ,  H04M1/0277 ,  H04M1/185 ,  H05K1/0256 ,  H05K1/0373 ,  H05K3/284 ,  H05K2203/1327

Abstract: Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.