公开(公告)号：WO2012125774A2

公开(公告)日：2012-09-20

申请号：PCT/US2012029138

申请日：2012-03-14

Applicant: INTEL CORP ,  PAN HELEN KANKAN ,  RUBERTO MARK ,  HORINE BRYCE D ,  RAVID SHMUEL

Inventor： PAN HELEN KANKAN ,  RUBERTO MARK ,  HORINE BRYCE D ,  RAVID SHMUEL

IPC: H01Q21/06 ,  H04B7/04

CPC classification number: H01Q21/067 ,  H01P11/001 ,  H01Q1/20 ,  H01Q1/2266 ,  H01Q1/2291 ,  H01Q3/34 ,  H01Q3/36 ,  H01Q7/00 ,  H01Q13/085 ,  H01Q13/16 ,  H01Q21/0087 ,  H01Q21/064 ,  H01Q21/24 ,  H01Q25/00 ,  H04B7/0413 ,  H04B7/10 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Disclosed is an integrated multiple phased antenna array on a flexible substrate with one RFIC. In this way the module can be molded onto the contour of a platform such as a notebook or a hub of the personal area network or local area network. The multiple phased array can be 3D bent in a compact size to fit into thin mobile platforms. Different array antennas or antennas radiate in different spherical directions with beam scanning capabilities while driven simultaneously by one RFIC chip.

Abstract translation: 本文描述了实现三维波束覆盖的无线天线阵列系统的实施例。 公开了一种在具有一个RFIC的柔性基板上的集成多相位天线阵列。 以这种方式，模块可以模制到诸如个人区域网络或局域网的笔记本或集线器之类的平台的轮廓上。 多个相控阵列可以以紧凑的尺寸进行3D弯曲，以适应薄移动平台。 不同的阵列天线或天线在具有光束扫描能力的不同球面方向上辐射，同时由一个RFIC芯片驱动。

公开(公告)号：WO2010078199A3

公开(公告)日：2010-10-14

申请号：PCT/US2009069442

申请日：2009-12-23

Applicant: INTEL CORP ,  CHOUDHURY DEBABANI ,  RUBERTO MARK

Inventor： CHOUDHURY DEBABANI ,  RUBERTO MARK

IPC: H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q21/0025 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01Q1/523 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/067 ,  H01L2224/05599

Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (?/2) corresponding to the one or more RF signals.

Abstract translation: 公开了使用多层衬底技术的毫米波阵列型架构的集成方法。 例如，装置可以包括第一衬底层，第二衬底层和第三衬底层。 第一衬底层具有第一多个阵列元件，并且第二衬底层具有第二多个阵列元件。 第三衬底层具有集成电路，以与第一和第二多个阵列元件交换一个或多个射频（RF）信号。 第一和第二衬底层被分开与一个或多个RF信号相对应的大约一半波长（λ/ 2）。

公开(公告)号：BRPI0923894A2

公开(公告)日：2015-07-28

申请号：BRPI0923894

申请日：2009-12-23

Applicant: INTEL CORP

Inventor： CHOUDHURY DEBABANI ,  RUBERTO MARK

IPC: H01Q21/00 ,  H01Q23/00

公开(公告)号：EP2686908A4

公开(公告)日：2014-09-03

申请号：EP12758343

申请日：2012-03-14

Applicant: INTEL CORP

Inventor： PAN HELEN KANKAN ,  RUBERTO MARK ,  HORINE BRYCE D ,  RAVID SHMUEL

IPC: H01Q21/06 ,  H04B7/04

CPC classification number: H01Q21/067 ,  H01P11/001 ,  H01Q1/20 ,  H01Q1/2266 ,  H01Q1/2291 ,  H01Q3/34 ,  H01Q3/36 ,  H01Q7/00 ,  H01Q13/085 ,  H01Q13/16 ,  H01Q21/0087 ,  H01Q21/064 ,  H01Q21/24 ,  H01Q25/00 ,  H04B7/0413 ,  H04B7/10 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A system according to one embodiment includes a first antenna element configured to communicate a first signal, the first signal polarized in a first orientation; a second antenna element co-located with the first antenna element, the second antenna element configured to communicate a second signal, the second signal polarized in a second orientation, the second orientation orthogonal to the first orientation; and driver circuitry coupled to the first antenna element and the second antenna element, the driver circuitry configured to process the first signal and the second signal to achieve signal diversity in a wireless communication link.

公开(公告)号：EP2380237A4

公开(公告)日：2015-08-12

申请号：EP09837046

申请日：2009-12-23

Applicant: INTEL CORP

Inventor： CHOUDHURY DEBABANI ,  RUBERTO MARK

IPC: H01Q21/00 ,  H01Q1/52 ,  H01Q21/06 ,  H01Q23/00

CPC classification number: H01Q21/0025 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01Q1/523 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/067 ,  H01L2224/05599

Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (lambda/2) corresponding to the one or more RF signals.

Abstract translation: 公开了使用多层衬底技术的mm波阵列型结构的集成方法。 例如，装置可以包括第一基底层，第二基底层和第三基底层。 第一基板层具有第一多个阵列元件，第二基板层具有第二多个阵列元件。 第三衬底层具有用于与第一和第二多个阵列元件交换一个或多个射频（RF）信号的集成电路。 第一和第二衬底层与对应于一个或多个RF信号的大约一半的波长（λ/ 2）分开。