公开(公告)号：US10256286B2

公开(公告)日：2019-04-09

申请号：US15589981

申请日：2017-05-08

Applicant: INTEL CORPORATION

Inventor： Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

IPC: H01F5/00 ,  H01F27/06 ,  G09G5/00 ,  H01L49/02 ,  H01F7/06 ,  H01L23/48 ,  H01L23/522 ,  H01F17/00 ,  H01L21/768 ,  H01L27/06 ,  H01L27/08

Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

公开(公告)号：US09881990B2

公开(公告)日：2018-01-30

申请号：US15169665

申请日：2016-05-31

Applicant: INTEL CORPORATION

Inventor： Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

IPC: H01F5/00 ,  H01F27/06 ,  G09G5/00 ,  H01L49/02 ,  H01F7/08 ,  H01L23/48 ,  H01L23/522 ,  H01F17/00 ,  H01L21/768 ,  H01L27/06 ,  H01L27/08

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01F2017/002 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0688 ,  H01L27/08 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/00012

Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.