公开(公告)号：US20160181714A1

公开(公告)日：2016-06-23

申请号：US14576735

申请日：2014-12-19

Applicant: INTEL CORPORATION

Inventor： GAURAV CHAWLA ,  David J. Llapitan ,  Jeffory L. Smalley ,  Tejinder Pal Aulakh ,  Vijaykumar Krithivasan ,  Donald T. Tran

IPC: H01R12/79 ,  H05K7/10 ,  G06F1/18 ,  H01R43/20

CPC classification number: H01R12/79 ,  G06F1/18 ,  H01R43/205 ,  H05K7/1069 ,  H05K7/1092

Abstract: A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

Abstract translation: 描述了使用弹簧偏压的多阵列底侧阵列的连接器。 在一个示例中，连接器包括连接器壳体，连接器壳体具有底表面，以及与底表面相对的多个弹性连接器，以电连接到集成电路封装的对应的多个焊盘;电缆连接器，用于电连接 电缆的弹性连接器，具有压靠电路板的底表面的基板和与底表面相对的顶表面，以及联接在基板和连接器底表面之间的多个弹簧构件，用于将基板 底部表面靠在系统板上，并将连接器外壳连接件按压在包装上。