公开(公告)号：US09823273B2

公开(公告)日：2017-11-21

申请号：US13931866

申请日：2013-06-29

Applicant: INTEL CORPORATION

Inventor： Keith J. Martin ,  Kip P. Stevenson ,  Kamil S. Salloum ,  Todd P. Albertson

IPC: G01R3/00 ,  G01R1/067

CPC classification number: G01R3/00 ,  G01R1/06738 ,  Y10T29/49124

Abstract: Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.