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公开(公告)号：WO2017160435A1
公开(公告)日：2017-09-21
申请号：PCT/US2017/017519
申请日：2017-02-10
Applicant: INTEL CORPORATION
Inventor： HEPPNER, Joshua D. , LIFF, Shawna M. , LI, Eric J. , PRAKASH, Anna M.
CPC classification number: B41F15/18 , B41F15/12 , B41F15/44 , B41L13/02 , B41L13/12 , B41L13/14 , H05K3/1233
Abstract: Described is an apparatus which comprises: a squeegee head which is operable to drop a material; and a vacuum manifold attachable to the squeegee head, wherein the vacuum manifold is operable to create a vacuum in a space prior to the squeegee head is to drop the material.
Abstract translation: 描述了一种设备，其包括：刮刀头，其可操作以落下材料; 以及可连接到刮刀头的真空歧管，其中真空歧管可操作以在刮刀头掉落材料之前在空间中产生真空。
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公开(公告)号：WO2019066831A1
公开(公告)日：2019-04-04
申请号：PCT/US2017/053857
申请日：2017-09-28
Applicant: INTEL CORPORATION
Inventor： CHIU, Chia-Pin , PRAKASH, Anna M.
Abstract: Aspects of the embodiments are directed to an opto-electronic device and methods of using the same. The opto-electronic device can include a processing device and a photonic device. The photonic device can include an optical demultiplexer; a collimating lens optically coupled to the optical demultiplexer and positioned to receive light from the optical demultiplexer, the collimating lens to collimate light received from the optical demultiplexer; a photodetector comprising a photosensitive element, the photosensitive element to convert received light into an electrical signal; and a focusing lens optically coupled to the photodetector, the focusing lens to receive light and focus the light towards the photosensitive element.
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Patent Agency Ranking
公开(公告)号：WO2017160468A1
公开(公告)日：2017-09-21
申请号：PCT/US2017/018408
申请日：2017-02-17
Applicant: INTEL CORPORATION
Inventor： DIAS, Rajendra C. , PRAKASH, Anna M. , HEPPNER, Joshua D. , LI, Eric J. , RARAVIKAR, Nachiket R.
IPC: H01L23/552 , H01L23/60 , H01L25/065 , H01L23/538
Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.
Abstract translation: 这里通常讨论的是包括或提供电磁干扰（EMI）屏蔽的方法和设备。 器件可以包括其中包括电连接电路的衬底，在衬底上或至少部分在衬底中的接地电路，至少部分地从衬底的表面暴露的接地电路，电连接到连接电路和接地电路的管芯 ，衬底上的管芯以及围绕管芯的导电箔或导电膜，导电箔或导电膜电连接到接地电路。
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公开(公告)号：WO2017160468A8
公开(公告)日：2017-09-21
申请号：PCT/US2017/018408
申请日：2017-02-17
Applicant: INTEL CORPORATION
Inventor： DIAS, Rajendra C. , PRAKASH, Anna M. , HEPPNER, Joshua D. , LI, Eric J. , RARAVIKAR, Nachiket R.
IPC: H01L23/552 , H01L23/60 , H01L25/065 , H01L23/538
Abstract: Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.
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5.发明申请COATED PROBE TIPS FOR PLUNGER PINS OF AN INTEGRATED CIRCUIT PACKAGE TEST SYSTEM 审中-公开用于集成电路封装测试系统的插针的涂层探针技巧
公开(公告)号：WO2017112037A1
公开(公告)日：2017-06-29
申请号：PCT/US2016/056662
申请日：2016-10-12
Applicant: INTEL CORPORATION
Inventor： YIN, Wen , PRAKASH, Anna M. , HAUGHAN, Teag R. , XU, Dingying David , AGUILAR-SANTILLAN, Joaquin
CPC classification number: G01R1/06761 , C11D11/0047 , C22F1/183 , C23C8/16 , C23C8/20 , C23C8/80 , C25D3/54 , C25D5/34 , C25D5/50 , C25D7/00 , G01R1/06722
Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.
Abstract translation: 针对集成电路封装测试系统的柱塞引脚描述了涂覆探针尖端。 一个示例具有柱塞，该柱塞具有与集成电路封装的焊球接触的顶端，用于保持柱塞并允许柱塞接近和离开封装的套筒，套筒保持在插座中，弹簧位于 用于驱动柱塞朝向封装的套筒，以及尖端上的涂层，涂层比焊球硬。
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公开(公告)号：WO2018125451A1
公开(公告)日：2018-07-05
申请号：PCT/US2017/063326
申请日：2017-11-27
Applicant: INTEL CORPORATION
Inventor： GAINES, Taylor , PRAKASH, Anna M. , RAMALINGAM, Suriyakala , LIU, Boxi , GUPTA, Mohit , BELMAN, Ziv , SCHIFFMANN, Baruch , HIRSHBERG, Arnon , MALAMUD, Vladimir , WITTENBERG, Ron
IPC: H01L23/552 , H01L23/60 , H01L23/36 , H01L23/28
Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.
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公开(公告)号：WO2018125027A1
公开(公告)日：2018-07-05
申请号：PCT/US2016/068635
申请日：2016-12-27
Applicant: INTEL CORPORATION
Inventor： YAZZIE, Kyle , PRAKASH, Anna M. , RAMALINGAM, Suriyakala , WANG, Liwei , STARKSTON, Robert , CHOUDHURY, Arnab , IYER, Sandeep S. , ABEBAW, Amanuel M. , LABANOK, Nick
Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
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