公开(公告)号：US20200273765A1

公开(公告)日：2020-08-27

申请号：US16286736

申请日：2019-02-27

Applicant: INTEL CORPORATION

Inventor： Yogasundaram Chandiran ,  Geejagaaru Krishnamurthy Sandesh ,  Pradeep Ramesh ,  Ranjul Balakrishnan

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

Abstract: A PCB having a first surface and a second surface includes a trench extending through the PCB, a plurality of conductive traces on one or more sidewalls of the trench. The plurality of conductive traces extends through the PCB and may be arranged in pairs across from one another along at least a portion of the length of the trench. A first set of conductive contacts are arranged in a first zig-zag pattern around a perimeter of the trench. A second set of conductive contacts are arranged in a second zig-zag pattern around the perimeter of the trench. In some cases, the first and second zig-zag patterns are arranged with respect to one another around the perimeter of the trench in an alternating fashion. A chip package is also disclosed having a pin arrangement that couples to the corresponding arrangement of conductive contacts on the PCB.

公开(公告)号：US11600544B2

公开(公告)日：2023-03-07

申请号：US16286736

申请日：2019-02-27

Applicant: INTEL CORPORATION

Inventor： Yogasundaram Chandiran ,  Geejagaaru Krishnamurthy Sandesh ,  Pradeep Ramesh ,  Ranjul Balakrishnan

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/11 ,  H05K1/02 ,  H05K1/18

Abstract: A PCB having a first surface and a second surface includes a trench extending through the PCB, a plurality of conductive traces on one or more sidewalls of the trench. The plurality of conductive traces extends through the PCB and may be arranged in pairs across from one another along at least a portion of the length of the trench. A first set of conductive contacts are arranged in a first zig-zag pattern around a perimeter of the trench. A second set of conductive contacts are arranged in a second zig-zag pattern around the perimeter of the trench. In some cases, the first and second zig-zag patterns are arranged with respect to one another around the perimeter of the trench in an alternating fashion. A chip package is also disclosed having a pin arrangement that couples to the corresponding arrangement of conductive contacts on the PCB.