公开(公告)号：WO2022125161A1

公开(公告)日：2022-06-16

申请号：PCT/US2021/051110

申请日：2021-09-20

Applicant: INTEL CORPORATION [US]/[US]

Inventor： RADHAKRISHNAN, Arunpandi ,  SINGH, Bijendra ,  ALVA, Samarth ,  KANIVIHALLI, Raghavendra S.

IPC: G06F1/20 ,  G06F1/16

Abstract: In one embodiment, a computer system (e.g., a notebook computer) includes a lid with a display and a base coupled to the lid at one end of the base. The base defines one or more openings proximate to the end at which the lid is coupled to the base, and the computer system further includes a solid panel positioned proximate to the openings in the base such that the panel partially blocks the openings of the base. The position of the solid panel with respect to the openings of the base is based on a position of the lid with respect to the base.

公开(公告)号：EP4002057A1

公开(公告)日：2022-05-25

申请号：EP21197807.7

申请日：2021-09-20

Applicant: INTEL Corporation

Inventor： RAJU, Prakash Kurma ,  ALVA, Samarth ,  ANBALAGAN, Bhavaneeswaran ,  BABU, Triplicane Gopikrishnan ,  PICHUMANI, Prasanna ,  DODDI, Raghavendra ,  SUDHAKAR, Sudheera ,  BAWA, Ritu

IPC: G06F1/16 ,  G06F1/20

Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

公开(公告)号：EP3974944A1

公开(公告)日：2022-03-30

申请号：EP21193294.2

申请日：2021-08-26

Applicant: INTEL Corporation

Inventor： ALVA, Samarth ,  CHANNAIAH, Yogesh

IPC: G06F1/16 ,  H04M1/02

Abstract: In one embodiment, a hinge apparatus (200) includes two curved rack apparatuses (210a, 210b), each curved rack apparatus defining an arcuate surface (214a) and an arcuate set of gear teeth (216a) concentric with the arcuate surface, where the radius of curvature of the arcuate set of gear teeth is non-uniform. The hinge apparatus further includes a gear assembly (220) that includes a first gear (224a), a second gear (224b), a third gear (226) coupling the first and second gears, a fourth gear (222a) coupling the first gear and the arcuate set of gear teeth of the first curved rack apparatus, and a fifth gear (222b) coupling the second gear and the arcuate set of gear teeth of the second curved rack apparatus.

公开(公告)号：EP4123420A1

公开(公告)日：2023-01-25

申请号：EP22161808.5

申请日：2022-03-14

Applicant: INTEL Corporation

Inventor： SINGH, Navneet Kumar ,  ALVA, Samarth ,  KANIVIHALLI, Raghavendra S. ,  PIOUS, Aiswarya M. ,  RAO, Samantha ,  SINGH, Bijendra

IPC: G06F1/20 ,  H01B7/42

Abstract: An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.

公开(公告)号：EP3865978A1

公开(公告)日：2021-08-18

申请号：EP20197338.5

申请日：2020-09-22

Applicant: INTEL Corporation

Inventor： SINGH, Bijendra ,  RAJU, Prakash Kurma ,  ALVA, Samarth

IPC: G06F1/20 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.