公开(公告)号：WO1997046066A1

公开(公告)日：1997-12-04

申请号：PCT/US1997009138

申请日：1997-05-30

Applicant: INTERGRAPH CORPORATION

Inventor： INTERGRAPH CORPORATION ,  WORDEN, Curtis, W.

IPC: H05K07/14

CPC classification number: G06F1/20

Abstract: A computer chassis having an improved airflow path along a removable circuit board (11) mounted inside a chassis (10). The removable circuit board has a connector (12) along one edge for connection to a mother board (30). The chassis has a rear panel (14), and the mother board mounted inside the chassis such that the rear edge of the mother board is spaced from the rear panel to define a setback, and an inset access (16) to the removable circuit board such that the inset access is positioned within the space forming the setback. The chassis also has an airflow path (40) along the removable circuit board, over the rear edge of the mother board and across the setback. The airflow path may end with a plurality of vent locations (21, 22) within the setback and in the rear panel proximate to the setback. These vent locations are for receiving air into and ejecting air out of the chassis. The mounting of the mother board may include an interior panel (13) mounted inside the chassis such that the interior panel is parallel to and spaced below the mother board. The interior panel may also be attached to the rear panel in a position transverse to the rear panel. Moreover, the means for providing an inset access to the removable circuit board may include a removable cover plate (20).

Abstract translation: 一种具有沿着安装在底盘（10）内的可移除电路板（11）的改进的气流路径的计算机机箱。 可拆卸电路板具有沿着一个边缘的连接器（12），用于连接到母板（30）。 底盘具有后面板（14），并且母板安装在机架内部，使得母板的后边缘与后面板间隔开以限定挫折，以及插入到可拆卸电路板 使得插页访问位于形成挫折的空间内。 机架还具有沿着可移除电路板的气流路径（40），在母板的后边缘上并且跨越挫折。 气流路径可以在挫折内的多个排气位置（21,22）和靠近挫折的后面板中终止。 这些排放位置用于接收空气并将空气从机箱中排出。 母板的安装可以包括安装在底盘内部的内部面板（13），使得内部面板平行于主板并且与主板间隔开。 内部面板也可以在与后面板横向的位置处附接到后面板。 此外，用于提供对可移除电路板的插入物接近的装置可以包括可移除的盖板（20）。

公开(公告)号：EP0903065A1

公开(公告)日：1999-03-24

申请号：EP97926796.0

申请日：1997-05-30

Applicant: Intergraph Corporation

Inventor： WORDEN, Curtis, W.

IPC: G06F1 ,  H05K7

CPC classification number: G06F1/20

Abstract: A computer chassis having an improved airflow path along a removable circuit board (11) mounted inside a chassis (10). The removable circuit board has a connector (12) along one edge for connection to a mother board (30). The chassis has a rear panel (14), and the mother board mounted inside the chassis such that the rear edge of the mother board is spaced from the rear panel to define a setback, and an inset access (16) to the removable circuit board such that the inset access is positioned within the space forming the setback. The chassis also has an airflow path (40) along the removable circuit board, over the rear edge of the mother board and across the setback. The airflow path may end with a plurality of vent locations (21, 22) within the setback and in the rear panel proximate to the setback. These vent locations are for receiving air into and ejecting air out of the chassis. The mounting of the mother board may include an interior panel (13) mounted inside the chassis such that the interior panel is parallel to and spaced below the mother board. The interior panel may also be attached to the rear panel in a position transverse to the rear panel. Moreover, the means for providing an inset access to the removable circuit board may include a removable cover plate (20).

公开(公告)号：EP0903065B1

公开(公告)日：2003-01-22

申请号：EP97926796.0

申请日：1997-05-30

Applicant: Intergraph Corporation

Inventor： WORDEN, Curtis, W.

IPC: H05K7/14 ,  G06F1/20

CPC classification number: G06F1/20

Abstract: A computer chassis having an improved airflow path along a removable circuit board (11) mounted inside a chassis (10). The removable circuit board has a connector (12) along one edge for connection to a mother board (30). The chassis has a rear panel (14), and the mother board mounted inside the chassis such that the rear edge of the mother board is spaced from the rear panel to define a setback, and an inset access (16) to the removable circuit board such that the inset access is positioned within the space forming the setback. The chassis also has an airflow path (40) along the removable circuit board, over the rear edge of the mother board and across the setback. The airflow path may end with a plurality of vent locations (21, 22) within the setback and in the rear panel proximate to the setback. These vent locations are for receiving air into and ejecting air out of the chassis. The mounting of the mother board may include an interior panel (13) mounted inside the chassis such that the interior panel is parallel to and spaced below the mother board. The interior panel may also be attached to the rear panel in a position transverse to the rear panel. Moreover, the means for providing an inset access to the removable circuit board may include a removable cover plate (20).