公开(公告)号：WO2004064463A3

公开(公告)日：2005-07-14

申请号：PCT/US2004000140

申请日：2004-01-06

Applicant: INTERLINK ELECTRONICS INC ,  BAKER JEFFREY R ,  SANCHEZ CARLOS S ,  TICKLE JAMES D

Inventor： BAKER JEFFREY R ,  SANCHEZ CARLOS S ,  TICKLE JAMES D

IPC: G06F3/033 ,  H01H13/785 ,  H04N5/44 ,  G09G5/08

CPC classification number: G06F3/0338 ,  H01H13/785 ,  H01H2201/032 ,  H01H2203/02 ,  H01H2221/012 ,  H04N2005/4417

Abstract: A pointing device may be directly soldered to a printed circuit board. In one embodiment, a bottom substrate defines a sensing region with a plurality of interdigitated conductive trace regions. Each trace region includes interdigitated common and sense traces. At least one via passes through the bottom substrate for each trace. Each via supports a conductive path from one trace to at least one lead element. Each lead element is solderable to a printed circuit board. A flexible substrate is constructed from a heat resistant polymer. The flexible substrate has a resistive layer deposited on a bottom side. A raised pedestal is formed on the bottom substrate top face around at least a portion of the sensing region. The pedestal separates the interdigitated conductive traces from the flexible substrate resistive layer. A button on a keypad membrane may be used to depress the flexible substrate onto the trace region.

Abstract translation: 指示设备可以直接焊接到印刷电路板。 在一个实施例中，底部基板限定具有多个叉指导电迹线区域的感测区域。 每个迹线区域包括交叉的公共和感测迹线。 每个迹线至少有一个通孔穿过底部基板。 每个通孔支持从一个迹线到至少一个引线元件的导电路径。 每个引线元件可焊接到印刷电路板。 柔性基材由耐热聚合物构成。 柔性基板具有沉积在底侧的电阻层。 凸起的基座围绕感测区域的至少一部分形成在底部基板顶面上。 基座将交错的导电迹线与柔性基板电阻层分开。 可以使用键盘膜上的按钮将柔性基板压在迹线区域上。

公开(公告)号：EP1581924A4

公开(公告)日：2007-01-24

申请号：EP04700361

申请日：2004-01-06

Applicant: INTERLINK ELECTRONICS INC

Inventor： BAKER JEFFREY R ,  SANCHEZ CARLOS S ,  TICKLE JAMES D

IPC: G06F3/033 ,  H01H13/785 ,  H04N5/44

CPC classification number: G06F3/0338 ,  H01H13/785 ,  H01H2201/032 ,  H01H2203/02 ,  H01H2221/012 ,  H04N2005/4417

Abstract: A pointing device may be directly soldered to a printed circuit board. In one embodiment, a bottom substrate defines a sensing region with a plurality of interdigitated conductive trace regions. Each trace region includes interdigitated common and sense traces. At least one via passes through the bottom substrate for each trace. Each via supports a conductive path from one trace to at least one lead element. Each lead element is solderable to a printed circuit board. A flexible substrate is constructed from a heat resistant polymer. The flexible substrate has a resistive layer deposited on a bottom side. A raised pedestal is formed on the bottom substrate top face around at least a portion of the sensing region. The pedestal separates the interdigitated conductive traces from the flexible substrate resistive layer. A button on a keypad membrane may be used to depress the flexible substrate onto the trace region.