公开(公告)号：WO2004026517A2

公开(公告)日：2004-04-01

申请号：PCT/US2003/029092

申请日：2003-09-12

Applicant: INTERNATIONAL BUSINESS MACHINE CORPORATION

Inventor： INTERRANTE, Mario ,  FARCOOQ, Mukta, G. ,  SABLINSKI, William, Edward

IPC: B23K

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K2201/36 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613

Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an inter­metallic phase structure in the module side fillet during assembly. The inter­metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).

Abstract translation: 一种用于诸如将电子模块（20）连接到电路板（120）的电子部件的第二级焊接连接中的无铅焊料层级。 模块侧连接使用SnCu或SnAg的非共晶焊料（60）浓度。 这种非共晶焊料（60）包含足够的金属间化合物，以使模块侧连接具有坚固的二级组件和返工过程。 脱共晶组合物（60）在组装期间在模块侧圆角中提供金属间相结构。 金属间相结构消除了在二级组装期间的倾斜和塌陷的问题，并且通过提供更多的内聚关节来帮助返修，从而允许从板（120）移除柱（100）而不从模块（20）同时移除。